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http://dx.doi.org/10.5228/KSPP.2008.17.5.337

A method for Thermal Control of Nano Injection Molding using the Peltier Devices  

Shin, H. (강원대학교 기계.메카트로닉스공학과)
Kwon, J. (강원대학교 기계.메카트로닉스공학과)
Hong, N. (강원인력개발원 컴퓨터응용기계과)
Seo, Y. (강원대학교 기계.메카트로닉스공학부)
Kim, B. (강원대학교 기계.메카트로닉스공학부)
Publication Information
Transactions of Materials Processing / v.17, no.5, 2008 , pp. 337-342 More about this Journal
Abstract
The injection molding process has high accuracy and good reproducibility that are essential for mass production at low cost. Conventional molding processes typically use the water-based mold heating and air cooling methods. However, in the nano injection molding processes, this semi-active mold temperature control results in the several defects such as air-flow mark, non-fill, sticking and tearing, etc. In order to actively control temperature of the molds and effectively improve the quality of the molded products, the novel nano injection molding system, which uses active heating and cooling method, has been introduced. By using the Peltier devices, the temperature of locally adiabatic molds can be controlled dramatically and the quality of the molded patterns can be improved.
Keywords
Injection Molding; Peltier Device; Active Heating and Cooling Method;
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