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http://dx.doi.org/10.5228/KSPP.2007.16.5.396

Influence of Laminating and Sintering Condition on Permittivity and Shrinkage During LTCC Process  

Jeong, M.S. (서울대학교)
Hwang, S.H. (서울대학교)
Chung, H.W. ((주)아이엠텍)
Rhim, S.H. (한국기술교육대학교 기계정보공학부)
Oh, S.I. (서울대학교 기계항공공학부)
Publication Information
Transactions of Materials Processing / v.16, no.5, 2007 , pp. 396-400 More about this Journal
Abstract
LTCC(Low Temperature Co-fired Ceramic) which offers a good performance to produce multilayer structures with electronic circuits and components has emerged as an attractive technology in the electronic packaging industry. In LTCC module fabrication process, the lamination and the sintering are very important processes and affect the electrical characteristics of the final products because the processes change the permittivity of ceramics and the dimension of the circuit patterns which have influences on electronic properties. This paper discusses the influence of lamination pressure and sintering temperature on the permittivity and the dimensional change of LTCC products. In the present investigation, it is shown that the permittivity increases along with increasing of the lamination pressure and the sintering temperature.
Keywords
LTCC(Low Temperature Co-fired Ceramic); Green Sheet; Ceramic; Lamination Pressure; Sintering Temperature; Permittivity;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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