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http://dx.doi.org/10.5228/KSPP.2006.15.7.518

The Influence of Diamond Abrasive Size on the Life of Tungsten Carbide Wet Drawing Dies  

Lee, S.K. (부산대 대학원 정밀기계공학과)
Kim, M.A. (부산대 대학원 정밀기계공학과)
Ko, D.C. (부산대 동남권부품소재산학협력혁신 연구소)
Kim, B.M. (부산대 정밀정형 및 금형가공 연구소)
Publication Information
Transactions of Materials Processing / v.15, no.7, 2006 , pp. 518-523 More about this Journal
Abstract
Wet wire drawing of brass coated steel wire, used for tire reinforcement, is realized with Tungsten Carbide(WC) dies sintered with a cobalt(Co) binder. Dies wear represents an important limitation to the production process and cost savings. Several parameters, such as Co content, WC grain size of tungsten carbide, sintering conditions, and so on, affect on the wear of the drawing die. In this study, the effect of the diamond abrasive particle size on the life of the WC centered dies of the wet wire drawing was investigated. Wet wire drawing experiments were carried out on a wet wire drawing machine. From the experiments, the dies life, dies fracture, wire surface roughness, and wire breaks were investigated. From the results, it was found that the wear of the WC dies increased with the increase in the diamond abrasive particle size.
Keywords
Wet Wire Drawing; Tungsten Carbide Dies; Die Life; Diamond Abrasive Size; Wet Wire Drawing Experiment;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
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