Browse > Article
http://dx.doi.org/10.5228/KSPP.2006.15.1.076

A Study on Plastic Injection Molding for Warpage Characteristics Evaluation of Mobile Phone Cover  

Kim O. R. (한국생산기술연구원 정밀금형팀)
Kim M. Y. (한국생산기술연구원 정밀금형팀)
Lee S. H. (한국생산기술연구원 정밀금형팀)
Kwon C. O. ((주)동아정밀 기술연구소)
Publication Information
Transactions of Materials Processing / v.15, no.1, 2006 , pp. 76-81 More about this Journal
Abstract
In this study, warpage characteristics of mobile phone cover through injection molding process were investigated using design of experiments in injection molding process. Warpage in plastic injection molding has a significant effect on quality of product. Effects of injection time, packing pressure, packing time, mold temperature and melt temperature on the warpage of mobile phone cover were considered by numerical analysis and experiment with Taguchi method. The degree of warpage for the injection molded part was measured by using three dimensional coordinate measurement machine. It was shown that temperature control factor has more significant effect on the warpage of mobile phone cover than pressure control factor.
Keywords
Injection Molding; Mobile Phone; Taguchi Method; Flow Analysis; Warpage; Deflection;
Citations & Related Records
연도 인용수 순위
  • Reference
1 B. H. Lee, B. H. Kim, 1997, Variation of Part Wall Thicknesses to Reduce Warpage of Injection Molded Part-Robust Design Against Process Variability, Polymer Plastics Technology & Engineering Journal, Vol.36, No.5, pp. 791-807   DOI   ScienceOn
2 S. H. Lee, C. J. Hwang, O. R. Kim, Y. M. Heo, 2004, The Warpage of Orthogonal Stiffened Structures in Injection Molding, PPS Asia/Australia meeting, pp. 45-46
3 M. C. Huang, C. C. Tai, 2001, The effective factors in the warpage problems of an injected-molded part with a thin shell feature, Journal of Materials Processing Technology, Vol. 110, pp. 1-9   DOI   ScienceOn
4 박성현, 1998, 현대실험계획법, 민영사
5 이상복, 2001, 기초부터 현장적용까지 알기쉬운 다구찌법, 상조사