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http://dx.doi.org/10.5228/KSPP.2005.14.5.460

A Study of Interface Heat Transfer Coefficient Between Die and Workpiece for Hot Forging  

Kwon J. W. (한국기계연구원 소재성형연구센타)
Lee J. H. (한국기계연구원 소재성형연구센타)
Lee Y. S. (한국기계연구원 소재성형연구센타)
Kwon Y. N. (한국기계연구원 소재성형연구센타)
Bae W. B. (부산대학교 정밀기계공학과)
Publication Information
Transactions of Materials Processing / v.14, no.5, 2005 , pp. 460-465 More about this Journal
Abstract
The temperature difference between die and workpiece has been frequently caused to various surface defects. The distribution and change for the temperature of forged part should be analyzed to prevent the generation of various defects related with the temperature. The surface temperature changes were affected with the interface heat transfer coefficient. Therefore, the coefficient is necessary to predict the temperature changes of die and workpiece. In this study, the experimental and FE analysis were performed to evaluate the coefficient with a function of pressure, temperature, material, and etc. The closed die upsetting was used to measure the coefficient on pressure over the flow stress. AISI1045, A16061, and Cu-OFHC were used to analyze the effect of material. The coefficient was increased with step-up of pressure between die and workpiece. And, A16061 was larger than that of the AISI1045 and Cu-OFHC up to the five times.
Keywords
Interface Heat Transfer Coefficient(IHTC); Thermal Conductivity; Pressure; Deformation;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
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