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http://dx.doi.org/10.5228/KSPP.2005.14.3.269

The Warpage Reduction for Intake Manifold Product  

Lee S. H. (한국생산기술연구원 정밀금형팀)
Shin K. H. (한국생산기술연구원 정밀금형팀)
Yoon G. S. (한국생산기술연구원 정밀금형팀)
Jung W. C. (한국생산기술연구원 정밀금형팀)
Jung T. S. (재영 솔루텍)
Heo Y. M. (한국생산기술연구원 정밀금형팀)
Publication Information
Transactions of Materials Processing / v.14, no.3, 2005 , pp. 269-276 More about this Journal
Abstract
The purpose of this research is the warpage reduction for intake-manifold which is made to the injection molding. Intake-manifold is assembling to ultra sonic welding after forming. Therefore deformation is influence on the performance and manufacture to intake-manifold product. Location and number of gates, filling time, mold temperature, packing time, packing pressure and cooling time are factors that affect the deformation of injection molding product. Therefore, the injection molding characteristics of intake-manifold and the estimated deformation are detected by CAE analysis and compare measuring data in this study.
Keywords
Intake-Manifold; Injection Molding; Warpage; Filling Time; Mold Temperature; Cooling Time; Packing Pressure;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
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