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http://dx.doi.org/10.5228/KSPP.2005.14.3.263

Beating Channel Layout Design and Evaluation Technology for SMC Molds  

Heo Y. M. (한국생산기술연구원 정밀금형팀)
Ko Y. B. (한국생산기술연구원 정밀금형팀)
Lee J. H. (㈜도하인더스트리 기술연구소)
Lee S. H. (한국생산기술연구원 정밀금형팀)
Publication Information
Transactions of Materials Processing / v.14, no.3, 2005 , pp. 263-268 More about this Journal
Abstract
Heating channel layout design and evaluation technology for SMC molding system was investigated in this work. Traditional rules of cooling channel design in injection molding were applied to the present work. Finite element thermal analysis with $ANSYS^{TM}$ was performed to evaluate the temperature distribution of SHC mold surface. SMC mold was manufactured to evaluate the effect of a proposed heating channel layout system on the temperature distribution of SMC mold surface and infrared camera was applied to a measurement of temperature distribution. It was shown that infrared camera application was possible in a measurement of temperature distribution on SHC mold surface.
Keywords
Heating Channel Layout; Molding System Design; Cooling Channel; Infrared Camera;
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