An Investigation of Microstructural Evolution and Sliding Wear Behavior of Ultra-Fine Grained 5052 Aluminum Alloy Fabricated by an Accumulative Roll-Bonding Process |
하종수
(국민대학교 신소재공학부)
강석하 (국민대학교 신소재공학부) 김용석 (국민대학교 신소재공학부) |
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An investigation of grain boundaries in submicrometer-grained Al-Mg solid solution alloys using high-resolution electron microscopy
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DOI ScienceOn |
2 |
Novel ultra-high straining process for bulk materials-development of the accumulative roll-bonding(ARB) process
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DOI ScienceOn |
3 |
Materials processing by simple shear
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DOI ScienceOn |
4 |
Deformation induced grain boundaries in commercially pure aluminum
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DOI ScienceOn |
5 |
Deformation mechanisms of pure Ti during equal channel angular pressing
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6 |
Plastic deformation of alloys with submicron grained structure
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DOI ScienceOn |
7 |
Factors influencing the equilibrium grain size in equal channel angular pressing: role of Mg additions to aluminum
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8 |
Developing superplasic properties in an aluminum alloy through severe plastic deformation
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DOI ScienceOn |
9 |
Observation of grain boundary structure in submicrometer-grained Cu and Ni using high-resolution electron microscopy
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DOI ScienceOn |