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http://dx.doi.org/10.5228/KSPP.2002.11.7.614

An Experimental Technique with Pattern Recognition for Deformation Measurement of Small Structures  

박태상 (한국과학기술원 기계공학과 대학원)
백동천 (한국과학기술원 기계공학과 대학원)
이순복 (한국과학기술원 기계공학과)
Publication Information
Transactions of Materials Processing / v.11, no.7, 2002 , pp. 614-619 More about this Journal
Abstract
For an accurate measurement of the material behavior of small structures, a new optical experimental technique is proposed to measure the deformation. The test method uses the dual microscope that can measure the relative deformation of two adjacent regions. The magnified view is captured by CCD cameras and the relative deformation can be measured by the pattern matching and tracing method. Using this experimental technique, the deformation of solder joints in electronic packaging and the strain of the nickel thin film are measured.
Keywords
Dual Microscope; Pattern Recognition; Nickel Thin Film; Solder Joint; Deformation Measurement;
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