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http://dx.doi.org/10.5228/KSPP.2002.11.7.601

Micromachining of Fused Silica by KrF Excimer Laser Induced Wet Etching  

백병선 (강원대학교 기계메카트로닉스공학부 대학원)
이종길 (한국산업기술대학교 기계공학과)
전병희 (인덕대학교 컴퓨터응용 기계계열)
김헌영 (강원대학교 기계메카트로닉스공학부)
Publication Information
Transactions of Materials Processing / v.11, no.7, 2002 , pp. 601-607 More about this Journal
Abstract
Optically transparent materials such as fused silica, quartz and crystal have become important in the filed of optics and optoelectronics. Laser ablation continues to grow as an important technique for micromachining and surface modification of various materials, because many problems caused by direct contact between tools and workpiece can be avoided. Especially, laser ablation with excimer lasers enables fine micromachining of transparent materials such as fused silica, quartz and crystal, etc. In this study, laser-induced wet etching of fused silica in organic solution was conducted. KrF excimer laser was used as a light source and acetone solution of pyrene was used as etchant. Changing the number of laser pulses, micro holes of various depths are fabricated.
Keywords
Fused Silica; Excimer Laser; Laser Etching; Organic Solution; Pyrene-Acetone;
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