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http://dx.doi.org/10.5228/KSPP.2002.11.7.596

Development of Ultrasonic Bonding Process for Micro Components  

김정호 (KAIST 기계공학과)
이지혜 (KAIST 기계공학과)
유중돈 (KAIST 기계공학과)
최두선 (KIMM 지능형 정밀기계연구부)
Publication Information
Transactions of Materials Processing / v.11, no.7, 2002 , pp. 596-600 More about this Journal
Abstract
The ultrasonic bonding method and its feasibility are investigated in this work for joining the micro components and MEMS packaging. The ultrasonic bonding process is analyzed using a lumped mode, and preliminary experiments using the eutectic solder and copper pin were carried out to verify possibility to MEMS packaging. The ultrasonic bonding process appears to be adequate for MEMS packaging by providing localized heating at the selected area. Microscopic behavior of the bond joint through ultrasonic vibration needs further investigation.
Keywords
Ultrasonic Bonding; MEMS Packaging; Localized Heating;
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