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http://dx.doi.org/10.5228/KSPP.2002.11.5.414

Numerical Analysis for Injection Molding of Precision Electronics Parts Using Three-Dimensional Solid Elements  

Park, K. (서울산업대학교 기계설계 자동화공학부, 정밀기계기술연구소)
Park, J.H. (삼성전기㈜ 생산기술연구소 금형팀)
Choi, S.R. (에스알테크㈜)
Publication Information
Transactions of Materials Processing / v.11, no.5, 2002 , pp. 414-422 More about this Journal
Abstract
Most of numerical analyses for injection molding have been based on the Hele Shaw's approximation: two-dimensional flow analysis. In some cases, that approximation causes significant errors due to loss of geometrical information as well as simplification of the flow characteristics along the thickness direction. The present work covers numerical analyses of injection molding using three-dimensional solid elements. The accuracy of the analysis results has been verified through some numerical examples in comparison with the classical shell-based approach. The Proposed approach is then applied to predict product defects and to improve flow characteristics for a precision electronics part. In addition, design of experiment has been utilized in order to find the optimal process conditions for better product quality.
Keywords
Finite Element Analysis; Injection Molding; Solid Element; Design of Experiment; Moldflow;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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