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http://dx.doi.org/10.4191/kcers.2017.54.4.08

Low Pressure Joining of SiCf/SiC Composites Using Ti3AlC2 or Ti3SiC2 MAX Phase Tape  

Septiadi, Arifin (School of Materials Science and Engineering, Yeungnam University)
Fitriani, Pipit (School of Materials Science and Engineering, Yeungnam University)
Sharma, Amit Siddharth (School of Materials Science and Engineering, Yeungnam University)
Yoon, Dang-Hyok (School of Materials Science and Engineering, Yeungnam University)
Publication Information
Journal of the Korean Ceramic Society / v.54, no.4, 2017 , pp. 340-348 More about this Journal
Abstract
$SiC_f/SiC$ composites were joined using a $60{\mu}m-thick$ $Ti_3AlC_2$ or $Ti_3SiC_2$ MAX phase tape. The filler tape was inserted between the $SiC_f/SiC$ composites containing a 12 wt.% $Al_2O_3-Y_2O_3$ sintering additive. The joining was performed to a butt-joint configuration at $1600^{\circ}C$ or $1750^{\circ}C$ in an Ar atmosphere by applying 3.5 MPa using a hot press. Microstructural and phase analyses at the joining interface confirmed the decomposition of $Ti_3AlC_2$ and $Ti_3SiC_2$, indicating the joining by solid-state diffusion. The results showed sound joining interface without the presence of cracks. Joining strengths higher than 150 MPa could be obtained for the joints using $Ti_3AlC_2$ or $Ti_3SiC_2$ at $1750^{\circ}C$, while those for joined at $1600^{\circ}C$ decreased to 100 MPa approximately without the deformation of the joining bodies. The thickness of initial filler tape was reduced significantly after joining because of the decomposition and migration of MAX phase owing to the plasticity at high temperatures.
Keywords
$SiC_f/SiC$ composites; Joining; $Ti_3AlC_2$; $Ti_3SiC_2$; Tape;
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Times Cited By KSCI : 4  (Citation Analysis)
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