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http://dx.doi.org/10.4191/kcers.2014.51.2.121

The Effect of Liquid Medium on Silicon Grinding and Oxidation during Wet Grinding Process  

Kwon, Woo Teck (Energy & Environmental Division, Korea Institute of Ceramic Engineering & Technology)
Kim, Soo Ryong (Energy & Environmental Division, Korea Institute of Ceramic Engineering & Technology)
Kim, Young Hee (Energy & Environmental Division, Korea Institute of Ceramic Engineering & Technology)
Lee, Yoon Joo (Energy & Environmental Division, Korea Institute of Ceramic Engineering & Technology)
Shin, Dong Geun (Energy & Environmental Division, Korea Institute of Ceramic Engineering & Technology)
Won, Ji Yeon (Energy & Environmental Division, Korea Institute of Ceramic Engineering & Technology)
Oh, Sea Cheon (Department of Environmental Engineering, Kongju National University)
Publication Information
Journal of the Korean Ceramic Society / v.51, no.2, 2014 , pp. 121-126 More about this Journal
Abstract
The influence of a liquid medium duringa wet-milling process in the grinding and oxidation of silicon powder was investigated. Distilled water, dehydrated ethanol and diethylene glycol were used as the liquid media. The applied grinding times were 0.5, 3, and 12 h. Ground silicon powder samples were characterized by means of aparticle size analysis, scanning electron microscopy(SEM), x-ray powder diffraction (XRD), FT-IR spectroscopy and by a chemical composition analysis. From the results of the characterization process, we found that diethylene glycol is the most efficient liquid medium when silicon powder is ground using a wet-milling process. The FT-IR results show that the Si-O band intensity in an unground silicon powder is quite strongbecause oxygen becomes incorporated with silicon to form $SiO_2$ in air. By applying deionized water as a liquid medium for the grinding of silicon, the $SiO_2$ content increased from 4.12% to 31.7%. However, in the cases of dehydrated ethanol and diethylene glycol, it was found that the $SiO_2$ contents after grinding only changed insignificantly, from 4.12% to 5.91% and 5.28%, respectively.
Keywords
Grinding; Liquid medium; Silicon; Oxidation; Silicon oxide;
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Times Cited By KSCI : 1  (Citation Analysis)
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