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http://dx.doi.org/10.4191/kcers.2012.49.6.549

Thermal Conducting Behavior of Composites of Conjugated Short Fibrous-SiC Web with Different Filler Fraction  

Kim, Tae-Eon (New Energy and Battery Engineering, Yonsei University)
Bae, Jin Chul (Division of Nano IT Convergence Center and Eco-composite Center, KICET)
Cho, Kwang Yeon (Division of Nano IT Convergence Center and Eco-composite Center, KICET)
Lee, Dong Jin (Division of Nano IT Convergence Center and Eco-composite Center, KICET)
Shul, Yong-Gun (Department of Chemical and Biomolecular Engineering, Yonsei University)
Publication Information
Abstract
Silicon carbide(SiC) exhibits many unique properties, such as high strength, corrosion resistance, and high temperature stability. In this study, a SiC-fiber web was prepared from polycarbosilane(PCS) solution by employing the electrospinning process. Then, the SiC-fiber web was pyrolyzed at $1800^{\circ}C$ in argon atmosphere after it was subjected to a thermal curing. The SiC-fiber web (ground web)/phenolic resin (resol) composite was fabricated by hot pressing after mixing the SiC-fiber web and the phenolic resin. The SiC-fiber web composition was controlled by changing the fraction of filler (filler/binder = 9:1, 8:2, 7:3, 6:4, 5:5). Thermal conductivity measurement indicates that at the filler content of 60%, the thermal conductivity was highest, at 6.6 W/mK, due to the resulting structure formed by the filler and binder being closed-packed. Finally, the microstructure of the composites of SiC-fiber web/resin was investigated by FE-SEM, EDS, and XRD.
Keywords
Silicon carbide; Polycabosilane; Electrospinning; Composites; Thermal conductivity;
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Times Cited By KSCI : 1  (Citation Analysis)
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