Mechanical Damage Behavior of Single Crystalline Silicon by Scratching Test |
김현호
(연세대학교 세라믹공학과)
정성민 (연세대학교 세라믹공학과) 이홍림 (연세대학교 세라믹공학과) |
1 |
Raman Microspectrocsopy Analysis of Pressure-induced Metallization in Scratching of Silicon
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DOI ScienceOn |
2 |
Crystal Orientation Dependence of Machining Demage-a Stress Model
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DOI |
3 |
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4 |
Determination of Unknown Stress States in Silicon Wafers Using Microlaser Raman Spectroscopy
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DOI ScienceOn |
5 |
Acoustic Emission Monitoring of Single Cracking Events and Associated Damage Mechanism Analysis in Indentation and Scratch Testing
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DOI ScienceOn |
6 |
Phase Transition of Single Crystal Silicon by Scratching Test
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과학기술학회마을 |
7 |
Stress and Structural Images of Microindented Silicon by Raman Microscopy
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DOI ScienceOn |
8 |
Origins of the Ductile Regime in Singlepoint Diamond Turning of Semiconductors
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DOI ScienceOn |
9 |
Surface Damage in Nanomachined Silicon
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DOI ScienceOn |
10 |
The Surface of Machined Silicon Wafer: a Raman Spectroscopic Study
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DOI ScienceOn |
11 |
Comprehensive Investigation of Polish-induced Surface Strain in <100> and <111> GaAs and InP
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DOI |
12 |
High Pressure Phases of c-Si
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13 |
Plastic Deformation of Silicon During Contact Sliding at Ambient Temperature
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DOI ScienceOn |
14 |
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15 |
Phase Transformation of Single Crystalline Silicon by Scratching
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