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http://dx.doi.org/10.4191/KCERS.2002.39.1.045

Densification Behavior of Reaction-Bonded Silicon Nitride Prepared by Using Coarse Si Powders  

이주신 (경성대학교 재료공학과)
문지훈 (경성대학교 재료공학과)
한병동 (한국기계연구원 재료기술연구부)
박동수 (한국기계연구원 재료기술연구부)
김해두 (한국기계연구원 재료기술연구부)
Publication Information
Journal of the Korean Ceramic Society / v.39, no.1, 2002 , pp. 45-50 More about this Journal
Abstract
Effect of sintering additives on the densification behavior of reaction-bonded silicon nitride prepared by using coarse Si powders is discussed. Sintering additives such as 6 wt% $Y_2O_3$+1wt% $A1_2O_3$ (6YlA) did not give rise to full densification, while full densification was obtained by using the sintering additives such as 6wt% $Y_2O_3$+3 wt% $A1_2O_3$+ 2wt% $SiO_2$ (6Y3A2S) and 9wt% $Y_2O_3$+ 1.5wt% $A1_2O_3$+ 3wt% $SiO_2$ (9Yl.5A3S). In the case of 6Y3A2S addition, high fracture strength of 960 MPa and the fracture toughness of $6.5 MPa.m^{1/2}$ were obtained.
Keywords
Sintered reaction-bonded silicon nitride; Coarse Si powders; Sintering additive; Densification;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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