Browse > Article
http://dx.doi.org/10.21289/KSIC.2020.23.1.25

A Study on the Sintering of Diamond Composite at Low Temperature Under Low Pressure and its Subsequent Conductive PVD Process for a Cutting Tool  

Cho, Min-Young (Dept. of Automotive engineering)
Ban, Kap-Soo (Dept. of Automotive engineering)
Publication Information
Journal of the Korean Society of Industry Convergence / v.23, no.1, 2020 , pp. 25-32 More about this Journal
Abstract
Generally, high-temperature, high-pressure, high-priced sintering equipment is used for diamond sintering, and conductivity is a problem for improving the surface modification of the sintered body. In this study, to improve the efficiency of diamond sintering, we identified a new process and material that can be sintered at low temperature, and attempted to develop a composite thin film that can be discharged by doping boron gas to improve the surface modification of the sintered body. Sintered bodies were sintered by mixing Si and two diamonds in different particle sizes based on CIP molding and HIP molding. In CVD deposition, CVD was performed using WC-Co cemented carbide using CH4 and H2 gas, and the specimen was made conductive using boron gas. According to the experimental results of the sintered body, as the Si content is increased, the Vickers hardness decreases drastically, and the values of tensile strength, Young's modulus and fracture toughness greatly increase. Conductive CVD deposited diamond was boron deposited and discharged. As the amount of boron added increased, the strength of diamond peaks decreased and crystallinity improved. In addition, considering the release processability, tool life and adhesion of the deposition surface according to the amount of boron added, the appropriate amount of boron can be confirmed. Therefore, by solving the method of low temperature sintering and conductivity problem, the possibility of solving the existing sintering and deposition problem is presented.
Keywords
Diamond; SiC; Composite; HIP; CVD; Scribing Wheel; LCD;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Bragg, W. Henry, and Bragg W. L. "The structure of the diamond." Proceedings of the Royal Society of London. Series A, Containing Papers of a Mathematical and Physical Character vol.89, no.610, pp.277-291, (1913).
2 Schafer, L., Hofer, M., & Kroger, R. "The versatility of hot-filament activated chemical vapor deposition." Thin Solid Films vol.515, no.3, pp.1017-1024, (2006).   DOI
3 Deshpandey, C. V., and R. F. Bunshah. "Diamond and diamondlike films: Deposition processes and properties." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films vol.7, no.3, pp.2294-2302, (1989).   DOI
4 Zeren, M., & Karagoz, S. "Sintering of polycrystalline diamond cutting tools." Materials & design vol.28, no.3, pp.1055-1058, (2007).   DOI
5 Zong, W. J., et al. "The material removal mechanism in mechanical lapping of diamond cutting tools." International Journal of Machine Tools and Manufacture vol.45, no.7-8, pp. 783-788, (2005).   DOI
6 Danninger, H., CALDERON, R. D. O., & GIERL-MAYER, C. H. R. I. S. T. I. A. N. "Powder Metallurgy and Sintered Materials." Additive Manufacturing vol.19, no.4, (2017).
7 Hall, H. Tracy. "Some high-pressure, hightemperature apparatus design considerations: Equipment for use at 100 000 atmospheres and $3000^{\circ}C$." Review of Scientific Instruments vol.29, no.4, pp.267-275, (1958).   DOI
8 Garcia, J., & Pitonak, R. "The role of cemented carbide functionally graded outer-layers on the wear performance of coated cutting tools." International Journal of Refractory Metals and Hard Materials vol.36, pp.52-59, (2013).   DOI
9 Gracio, J. J., Q. H. Fan, and J. C. Madaleno. "Diamond growth by chemical vapour deposition." Journal of Physics D: Applied Physics vol.43, no.37, pp.374017, (2010).   DOI
10 Balmer, R. S., Brandon, J. R., Clewes, S. L., Dhillon, H. K., Dodson, J. M., Friel, I., Inglis, P. N., Madgwick, T. D., Markham, M. L., Mollart, T. P., "Chemical vapour deposition synthetic diamond: materials, technology and applications." Journal of Physics: Condensed Matter vol.21, no.36, pp.364221, (2009).   DOI
11 K.S. Ban, et al. "Development of manufacturing method to Ultra low cost and low pressure Sintered Diamond compared to the PCD (polycrystalline diamond sintered body), Final Report of SMTECH (2016)