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Simulation of Warpage and Residual Stress of Liquid Crystal Polymer Injection Molded Pare with Multi-holes and Thin Wall  

정만석 (한양대학교 섬유고분자공학과, 기능성고분자 신소재연구센터)
김성훈 (한양대학교 섬유고분자공학과, 기능성고분자 신소재연구센터)
Publication Information
Textile Science and Engineering / v.39, no.5, 2002 , pp. 589-597 More about this Journal
Abstract
CAE(Computer Aided Engineering) simulations of thin-wall injection molded parts of thermotropic liquid crystal polymer and common thermoplastics were performed. Micro-injection molded parts composed of thermortopic liquid cyrstal polymer are widely used in electronics and tole-communication terminals. The present paper deals with the development of efficient formulation for numerical integration, by which problems involving thin complex injection molded products can be solved to predict residual stresses, shrinkage, and warpage. Parameters of processing condition (material, thickness, packing pressure, flow rate, cooling stage, and mold temperature) result in diverse variations of residual stresses, total deflection, and warpage shape. The optimal processing conditions are obtained for the least warpage and internal stress of LCP micro-injection molded parts.
Keywords
liquid crystal polymer; thin-wall molded part, CAE; moldflow; residual stress; warpage;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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