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http://dx.doi.org/10.5762/KAIS.2015.16.5.3035

The Structural Analysis of Three-Way Catalyst Substrate using Coupled Thermal-Fluid-Structural Analysis  

Lee, Sung-Riong (Department of Materials and Metallurgical Engineering, Kangwon National University)
Cho, Seok-Swoo (Department of Mechanical Design Engineering, Kangwon National University)
Publication Information
Journal of the Korea Academia-Industrial cooperation Society / v.16, no.5, 2015 , pp. 3035-3043 More about this Journal
Abstract
This study evaluates the thermal structural safety of the three-way catalyst(TWC) substrate for domestic passenger cars. Thermal-fluid boundary conditions on the TWC substrate were determined by D-optimal DOE. The thermal stresses on the TWC substrate were calculated by the temperature distribution obtained from the CFD results. The safety factors of the TWC substrate were determined by statistical strength and stress distributions and estimated to be 0.275. The thermal stresses for TWC substrate exceeded the strength of the material. Therefore, it is necessary to redesign the TWC substrate because it has much shorter service life than design life.
Keywords
Three-Way Catalyst(TWC) Substrate; Thermal-Fluid-Structural Analysis; Design Life; Service Life; Safety Factor;
Citations & Related Records
Times Cited By KSCI : 5  (Citation Analysis)
연도 인용수 순위
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