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http://dx.doi.org/10.5762/KAIS.2015.16.2.1364

A Study on the High Viscosity Photosensitive Polyimide Degassing and Pumping System  

Park, Hyoung-Keun (Department of Electronic Engineering, Namseoul University)
Publication Information
Journal of the Korea Academia-Industrial cooperation Society / v.16, no.2, 2015 , pp. 1364-1369 More about this Journal
Abstract
As the wire bonding process has been converted into BUMP process due to the high density integration of semiconductor chip, the telecommunication line connecting to semiconductor chip and external devices have become finer. As a result, a more precise work is necessary. However, it is difficult to control quantity given the nature of high viscosity of PSPI and the yield rate continues to decline due to the inflow of bubble. Therefore, this paper developed the D&P(degassing and pumping) system to remove and supply gas that is generated from coating the high viscosity photosensitive polyimide(PSPI) in the semiconductor BUMP process.
Keywords
Degassing; Chemical Pumping; Photosensitive Polyimide; BUMP;
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Times Cited By KSCI : 1  (Citation Analysis)
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