Browse > Article
http://dx.doi.org/10.5762/KAIS.2014.15.8.4749

Effect of the variation of base thickness on the heat release performance of the heat sink  

Kim, Jung Hyun (Division of Mechanical Design Engineering, Chonbuk National University)
Lee, Gyo Woo (Division of Mechanical Design Engineering, Chonbuk National University)
Publication Information
Journal of the Korea Academia-Industrial cooperation Society / v.15, no.8, 2014 , pp. 4749-4755 More about this Journal
Abstract
In this study, to maximize the heat release from the heat generating environment, such as a high-capacity inverter, the heat release performance of the extruded-type heat sinks with the variation of the base thickness were investigated using the experimental and numerical methods. The base thickness was varied from 5 to 14 mm. The heat release was characterized by the amount of heat released through the heat sink, the surface temperature of heat sink base between the heat sources, and temperature of heat sources. The surface temperatures between heat sources and the amounts of heat release were improved more as the base thickness was decreased. In contrast, the temperatures of the heat sources decreased with increasing base thickness. Based on the case study of these heat sinks, it is believed that a heat sink with a 9.5mm-thick base was optimized for the heat release.
Keywords
Heat sink; Base plate; Heat release; Forced convection; Extruded-type;
Citations & Related Records
Times Cited By KSCI : 9  (Citation Analysis)
연도 인용수 순위
1 Santi, E., Caiafa, A., Kang, X., Hudgins, J. L., Palmer, P. R., Goodwine, D. and Monti, A., "Temperature Effects on Punch-Through IGBTs", IEEE Trans. on Industry Applications, Vol. 40, No. 2, pp. 472-482, 2004. DOI: http://dx.doi.org/10.1109/TIA.2004.824513   DOI   ScienceOn
2 Lee, S. H. and Chung, H. J., "Study on Lifetime Estimation of TFT-LCD Modules by Temperature Stress", J. of Korea Institute of Information Tech., Vol. 7, No. 5, pp. 1-7, 2009.
3 Lee, J. W., "Design of a Heat Dissipation System for the 400kW IGBT Inverter", The Trans. of the KIPE, Vol. 9, No. 4, pp. 350-355, 2004.   과학기술학회마을
4 Ko, M. S., Lee, J. H., Oh, S. J., Cho, H. S. and Seo, T. B., "Cooling Performance of LED Head Lamp with Heat Sink and Cooling Fan", Trans. Korean Soc. Mech. Eng. B, Vol. 33, No. 12, pp. 947-951, 2009. DOI: http://dx.doi.org/10.3795/KSME-B.2009.33.12.947   과학기술학회마을   DOI
5 Kim, T. H., Do, K. H., Choi, B. I., Han, Y. S. and Kim, M. B., "Development of a Cooling System for a Concentrating Photovoltaic Module", Trans. Korean Soc. Mech. Eng. B, Vol. 35, No. 6, pp. 551-560, 2011. DOI: http://dx.doi.org/10.3795/KSME-B.2011.35.6.551   DOI
6 Lee, K. W., Park, K. H., Rhi, S. H. and Yoo, S. Y., "Heat Pipe Heat Sink Development for Electronics Cooling", SAREK, Vol. 14, No. 8, pp. 664-670, 2002.   과학기술학회마을
7 Kosar, A., "Effect of substrate thickness and material on heat transfer in microchannel heat sinks", Int'l J. of Thermal Sciences, Vol. 49, pp. 635-642, 2010. DOI: http://dx.doi.org/10.1016/j.ijthermalsci.2009.11.004   DOI
8 Li, J. and Shi, Z. S., "3D numerical optimization of a heat sink base for electronics cooling", Int'l Communications in Heat and Mass Transfer, Vol. 39, pp. 204-208, 2012. DOI: http://dx.doi.org/10.1016/j.icheatmasstransfer.2011.12.001   DOI
9 Kim, J. H., Yun, J. H. and Lee, C. S., "An Experimental Study on the Thermal Resistance Characteristics for Various Types of Heat Sinks", SAREK, Vol. 14, No. 8, pp. 676-682, 2002.   과학기술학회마을
10 Kim, J. S., Ha, S. J. and Kwon, Y. H., "A Study on Cooling Performance of Aluminium Heat Sink with Pulsating Heat Pipe", J. of the Korean Soc. of Marine Eng., Vol. 35, No. 8, pp. 1016-1021, 2011. DOI: http://dx.doi.org/10.5916/jkosme.2011.35.8.1016   과학기술학회마을   DOI
11 White, Frank M., "Fluid mechanics", 5th ed., McGraw-Hill, 2003.
12 Riu, K. J., Park C. W., Kim, H. W. and Jang, C. S., "Cooling Characteristics of a Strip Fin Heat Sink", Trans. Korean Soc. Mech. Eng. B, Vol. 29, No. 1, pp. 16-26, 2005. DOI: http://dx.doi.org/10.3795/KSME-B.2005.29.1.016   과학기술학회마을   DOI
13 Kim, K. J., "Numerical study on the thermal behavior of a natural convection hybrid fin heat sink", J. of the Korean Soc. of Marine Eng., Vol. 37, No. 1, pp. 35-39, 2013. DOI: http://dx.doi.org/10.5916/jkosme.2013.37.1.35   과학기술학회마을   DOI
14 Mohan, R. and Govindarajan, DR. P., "Thermal Analysis of CPU with variable Heat Sink Base Plate Thickness using CFD", International J. of the Computer, the Internet and Management, Vol. 18, No. 1, pp. 27-36, 2010.
15 Kim, J. H., and Lee, G. W., "Performance Evaluation of Swaged-and Extruded-type Heat Sinks Used in Inverter for Solar Power Generation", Trans. Korean Soc. Mech. Eng. B, Vol. 37, No. 10, pp. 933-940, 2013. DOI: http://dx.doi.org/10.3795/KSME-B.2013.37.10.933   과학기술학회마을   DOI
16 Incropera, F. P., DeWitt, D. P., Bergman, T. L. and Lavine, A. S., "Introduction to Heat Transfer," 5th ed., John Wiley and Sons, 2006.