Study for Mechanical Strength according to Thickness of Specimen in the Ceramic Injection Molding Process |
Kim, Jinho
(Samsung electronics Co. Ltd., Advanced Technology Training Institute)
Hong, Seokmoo (Samsung electronics Co. Ltd., Global Technology Center) Hwang, Jihoon (Samsung electronics Co. Ltd., Global Technology Center) Lee, Jongchan (Department of Mechanical Engineering, Kumoh University) Kim, Naksoo (Department of Mechanical Engineering, Sogang University) |
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