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Kazutaka Kasuga, Mitsuko Saito, Tsutomu Takeya, Noriyuki Miura, Hiroki Ishikuro and Tadahiro Kuroda, "A Wafer Test Method of Inductive-Coupling Link", IEEE Asian Solid- State Circuits Conference, pp. 301-304, Nov. 2009.
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Lei Luo, John M. Wilson, Stephen E. Mick, JianXu, Liang Zhang, and Paul D. Franzon, "3 Gb/s AC Coupled Chip-to-Chip Communication Using a Low Swing Pulse Receiver", IEEE Journal of Solid-State Circuits, vol. 41, no. 1, pp.287-296, Jan. 2006.
DOI
ScienceOn
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Noriyuki Miura, Daisuke Mizoguchi, Mari Inoue, KiichiNiitsu, Yoshihiro Nakagawa, Masamoto Tago, Muneo Fukaishi, "A 1Tb/s 3W Inductive-Coupling Transceiver for 3D-Stacked Inter-Chip Clock and Data Link", IEEE Journal of Solid-State Circuits, vol. 42, no. 1, pp.111-121, Jan. 2007.
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Sanjay K. Thakur, Rubin A. Parekhji, A. N. Chandorkar, "On-chip Test and Repair of Memories for Static and Dynamic Faults", IEEE International test conference, 2006
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John Wilson, Member, Stephen Mick, JianXu, Member, Lei Luo, Salvatore Bonafede, Alan Huffman, "Fully Integrated AC Coupled Interconnect, Using Buried Bumps", IEEE Trans. Actions on Advanced Packing, vol. 30, no. 2, pp.191-199, May 2007.
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Noriyuki Miura, Yoshinori Kohama, Yasufumi Sugimori, Hiroki Ishikuro, Takayasu Sakurai, Tadahiro Kuroda An, "11Gb/s Inductive-Coupling Link with Burst Transmission", IEEE International Solid-State Circuits Conference, pp.297-299, 2008.
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