1 |
Report on the Environment-Friendly Industry (Plating Industry), pp. 20, MKE, 2003.
|
2 |
KETI, Market Trends and Technology Development on Cu Plating Solutions, pp. 1, 2010.
|
3 |
S. Mizuki, H. Nawahune, M. Mizaki, S. Kinisita, K. Araki, Fatigue Flexibility of the Surfaced Formed by Electroless Copper Plating, Metal Surface Treatment, 33, pp. 386, 1982.
|
4 |
A.S.T.M. X-ray diffraction index card, NO.4-0836, 1991.
|
5 |
T. Kanbe, NP Series Electroless Plating(1st ed.), Makisyoten, Tokyo, 1984.
|
6 |
McGraw-Hill, Encyclopedia of Science and Technology, pp. 544, McGraw-Hill Company, New York, 1977.
|
7 |
A.W. Goldenstein, W. Rostoker, F. Schossberger and G. Gutzeit, J. Electrochem. Soc., 104, pp. 104, 1957.
DOI
|
8 |
M. Paunovic, Electrochemical Aspects of Electroless Deposition of Metals, Plating, November, pp. 1163, 1968.
|
9 |
Kim Chang Wook, The J. of K.W.U., 15, pp. 144, 1986.
|
10 |
W. Mindt, J. Electrochem. Soc., 117, pp. 615, 1970.
DOI
|
11 |
T. K. Chee and W. K. Yeo, Electroless Nickel Plating, Metal Surface Treatment, 15, pp. 1, 1982.
|
12 |
W. Goldie, Metallic Coating of Plastics, Electrochemical publications Ltd., Middlesex, 1968.
|
13 |
H. Adachi, K. Taki, S. Nagamine, A. Yusa and M. Ohshima, Supercritical carbon dioxide assisted electroless plating on thermoplastic polymers, J. of Supercritical Fluids, 49, pp. 265, 2009.
DOI
|
14 |
P. Jalonen, A new concept for making fine line substrate for active component in polymer, Microelectronics Journal, 34, pp. 99, 2003.
DOI
|
15 |
J. Hajdu and G. Krulik : Comparison of Electroless Deposits For Electromagnetic Interference Shielding, pp. 42, Plating and Surface Finishing, 1983.
|
16 |
T. Osaka, K. Nibin, Advanced Functional Film Process Technology, pp. 741, Tokyo, 1987.
|