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http://dx.doi.org/10.5762/KAIS.2011.12.9.4015

Effect of Compositional Ratio of Additives on the Plating Properties in Environment-Friendly Electroless Plating Reaction  

Chun, Kyung-Soo (Department of Chemistry, Kyungwon University)
Paik, Gwi-Chan (Department of Industrial Chemistry, Sangmyung University)
Publication Information
Journal of the Korea Academia-Industrial cooperation Society / v.12, no.9, 2011 , pp. 4015-4021 More about this Journal
Abstract
The purpose of this study is to investigate the effect of compositional ratio of additives, such as potassium ferrocyanide, aminoacetic acid (=glycine) and 2,2'-dipyridyl, on the physical properties of copper layer deposited by environment-friendly electroless plating reaction. The highest plating rate of copper layer, $9.5mg{\cdot}cm^{-2}{\cdot}hr^{-1}$, was obtained at 20 mg/L of potassium ferrocyanide and 0.01 mol/L of aminoacetic acid, which coincided with the change in the hardness of the copper layer. In the additives used in this study, potassium ferrocyanide was considered to improve the plating rate, aminoacetic acid increased the hardness value of deposited films and 2,2'-dipyridyl enhanced the brightness of copper deposited films.
Keywords
Electroless plating; Additives; Plating rate; Hardness; Compositional ratio;
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