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http://dx.doi.org/10.5695/JKISE.2016.49.5.447

Process Optimization for Life Extension of Electropolishing Solution using Half Round Bus Bar  

Kim, Soo Han (Department of Chemical Engineering, Kwangwoon University)
Lee, Seung Heon (Department of Chemical Engineering, Kwangwoon University)
Cho, Jaehoon (Green Process and Materials R&D Group, Korea Institute of Industrial Technology (KITECH))
Lim, Dong-Ha (Energy Plant Group, Korea Institute of Industrial Technology (KITECH))
Choi, Joongso (Department of Chemical Engineering, Kwangwoon University)
Park, Chulhwan (Department of Chemical Engineering, Kwangwoon University)
Publication Information
Journal of the Korean institute of surface engineering / v.49, no.5, 2016 , pp. 447-453 More about this Journal
Abstract
In this study, we intended to extend the life of electropolishing solution through the reduction of electric resistance by improving the electrolysis efficiency. The optimum conditions were obtained by half round bus bar and Taguchi method. As the main control factors in the electropolishing process, current density, polishing time, electrolyte temperature and flow rate were selected. The electrolyte temperature was the most significant to the electrolysis efficiency. The optimum conditions for the life extension of electropolishing solution were as follows: current density, $45A/dm^2$; polishing time, 6 min; electrolyte temperature, $70^{\circ}C$; flow rate, 11 L/min. As a results of ANOVA of SN ratios, it was found that the electrolyte temperature was significant factor at the 90% confidence level.
Keywords
Electropolishing; Half round bus bar; Life extension; SN ratio; Taguchi;
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Times Cited By KSCI : 2  (Citation Analysis)
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1 H. L. Kellner, K. J. Gatchel, Electroplating engineering handbook, L. J. Durney, Fourth Ed, Van Nostrand Reinhold Company Inc, New York (1984) 61-78.
2 D. E. Ward, Electroplating engineering handbook, L. J. Durney, Fourth Ed, Van Nostrand Reinhold Company Inc, New York (1984) 100-120.
3 H. T. Yeom, J. S. Lee, Plating and surface treatment, Moonyeondang, Seoul (1999) 77-119.
4 S. J. Lee, J. J. Lai, The effects of electropolishing (EP) process parameters on corrosion resistance of 316L stainless steel. J. Mater. Process. Tech., 140 (2003) 206-210.   DOI
5 E. S. Lee, Machining characteristics of the electropolishing of stainless steel(STS316L), Int. J. Adv. Manuf. Tech., 16 (2000) 591-599.   DOI
6 A. P. Davis, C. Bernstein, P. M. Gietka, Waste minimization in electropolishing: Process control, Proc. of 27th Mid-Atlantic Industrial Waste Conference: Hazardous and Industrial Wastes, (1995) 62-71.
7 M. Paunovic, Modern electroplating: Part A. Electrochemical aspects, M. Schlesinger, M. Paunovic, fourth Ed, John Wiley & Sons, Inc. New York (2000) 13-16.
8 Japan's vocational training center, Plating technology: Electroplating, Third Ed, Sehwa, Seoul (1996) 31-38.
9 SEMI, SEMI Standards: SEMI E49.4-0298-Guide for high purity solvent distribution systems in semiconductor manufacturing equipment, SEMI, San Jose (2004) 1-3.
10 J. A. Ghani, I. A. Choudhury, H. H. Hassan, Application of Taguchi method in the optimization of end milling parameters, J. Mater. Process. Tech., 145 (2002) 84-92.
11 H. C. Kim, Introduction to design of experiments, Hanol Publishing, Seoul (2007) 363-391.
12 S. H. Park, J. W. Kim, Modern design of experiments using Minitab, Minyoungsa, Seoul (2013) 529-553.
13 M. Nalbant, H. Gokkaya, G. Sur. Application of Taguchi method in the optimization of cutting parameters for surface roughness in turning, Mater. Design, 28 (2007) 1379-1385.   DOI
14 Y. W. Cho, M. K. Park, The parameter optimization decision of surface roughness using Taguchi method, J. Soc. Korea. Ind. Syst. Eng., 21 (1998) 221-227.
15 J. E. Chung J. K. Ahn, A Study of robust design of FCM gasket using Taguchi method, J. Korea. Acad. Industr. Coop. Soc., 14 (2013) 3177-3183.   DOI
16 Y. S. Kim, K. S. Chang, Impact toughness improvement of an undercarriage track shoe using the Taguchi orthogonal array experiment, J. Korea. Acad. Industr. Coop. Soc., 16 (2015) 1611-1619.   DOI