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http://dx.doi.org/10.5695/JKISE.2015.48.3.73

Effects of Electrodeposition Conditions on Properties of Ni Thin Films Electrodeposited from Baths Fabricated by Dissolving Metal Ni Powders  

Yoon, Pilgeun (Department of Advanced Materials Engineering, Hanbat National University)
Park, Keun-Yong (Department of Advanced Materials Engineering, Hanbat National University)
Uhm, Young Rang (Korea Atomic Energy Research Institute)
Choi, Sun Ju (Korea Atomic Energy Research Institute)
Park, Deok-Yong (Department of Advanced Materials Engineering, Hanbat National University)
Publication Information
Journal of the Korean institute of surface engineering / v.48, no.3, 2015 , pp. 73-81 More about this Journal
Abstract
Chloride plating solution was fabricated by dissolving metal Ni powders in solution with HCl and deionized water. Effects of deposition conditions on the properties of Ni films electrodeposited from chloride baths were studied. Current efficiency of Ni films electrodeposited from the baths containing saccharin was decreased with increasing the current density. Residual stress of Ni thin films ware measured to be about 230 ~ 435 MPa in the range of current density of $10{\sim}25mA/cm^2$. Cathode current efficiency in baths without saccharin was initially increased with increasing pH, while it was decreased with increasing pH further. Cathode current efficiency in baths with saccharin (except at pH 2) exhibited less 10 ~ 20% than that in baths without saccharin. Residual stress of Ni films electrodeposited from baths without saccharin was measured to be 388 ~ 473 MPa in the range of pH 2 ~ pH 5 and then was increased to 551 MPa at pH 6. On the other hand, residual stress of Ni films electrodeposited from baths with saccharin was increased with increasing pH. Surface morphology was strongly affected by the change of current density, but slightly by solution pH and addition of saccharin.
Keywords
$^{63}Ni$ sealed source; Electrodeposition; Current density; Current efficiency; solution pH;
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Times Cited By KSCI : 2  (Citation Analysis)
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