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http://dx.doi.org/10.5695/JKISE.2011.44.1.007

The Effect of Polyethylene Glycol on the Trivalent Chromium Electroplating  

Lee, Joo-Yul (Materials Processing Division, Korea Institute of Materials Science)
Phuong, Nguyen Van (Anastro Laboratory, Department of Chemistry, Changwon National University)
Lim, Sung-Hwan (Microstructure & Materials Design Lab, Department of Advanced Materials Science and Engineering, Kangwon National University)
Han, Seung-Zeon (Materials Processing Division, Korea Institute of Materials Science)
Kwon, Sik-Chol (Materials Processing Division, Korea Institute of Materials Science)
Publication Information
Journal of the Korean institute of surface engineering / v.44, no.1, 2011 , pp. 7-12 More about this Journal
Abstract
The effect of organic additives, polyethylene glycol (PEG), on the trivalent chromium electroplating was analysed in the view point of current efficiency, solution stability and metallurgical structure. It was measured that PEG-containing trivalent chromium solution had about 10% higher current efficiency than pure solution and controlled the micro-crack density of electrodeposits. PEG exhibited profound effect on the solution stability by reducing the consumption rate of formic acid which acts as a complexant to lower the activation energy required for electrochemical reduction of trivalent chromium ions. It was also revealed that the formation of chromium carbide layer was facilitated in the presence of polyethylene glycol, which meant easier electrochemical codeposition of chromium and carbon, not single chromium deposition. Trivalent chromium layer formed from PEG-containing solution was amorphous with local nano-crystalline particles, which were prominently developed on the entire surface after non-oxidative heat treatment.
Keywords
Electrochemical deposition; Trivalent chromium; Polyethylene glycol; Chromium carbide;
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Times Cited By KSCI : 2  (Citation Analysis)
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1 Z. Zeng, Y. Sun, J. Zhang, Electrochem. Commun. 11 (2009) 331.   DOI
2 J.-Y. Lee, M. Kim, S. C. Kwon, Trans. Nonferrous Met. Soc. China, 19 (2009) 819.   DOI
3 Z. V. Feng, X. Li, A. A. Gewirth, J. Phys. Chem. B, 107 (2003) 9415.   DOI
4 J.-Y. Lee, N. V. Phuong, D. K. Kang, M. Kim, S. C. Kwon, J. Kor. Inst. Surf. Eng., 43(6) (2010) 297.   과학기술학회마을   DOI
5 S. K. Ibrahim, A. Watson, D. T. Gawne, Trans IMF, 75(5) (1997) 181.   DOI
6 C.-T. Lee, B.-H. Jeong, J. Korean Ind. Eng. Chem. 14(7) (2003) 959.   과학기술학회마을
7 Z. Zeng, Y. Sun, J. Zhang, Electrochem. Comm., 11 (2009) 331.   DOI
8 L. N. Vykhodtseva, A. A. Edigaryan, E. N. Lubmin, Yu. M. Polukarov, V. A. Safonov, Russian J. Electrochem., 40 (2004) 387.   DOI
9 G. B. Hoflund, D. A., Asbury, S. J. Babb, A. A. Grogan, H. A. Laitinen, S. Hoshino, J. Vac. Sci., Technol., 4 (1986) 26.   DOI
10 D. M. Brewis, D. Briggs, Polymer, 22 (1981) 7.   DOI
11 F. Ebrahimi, G. R. Bourne, M. S. Kelly, T. E. Matthews, Nanostruct. Mater., 11(3) (1999) 343.   DOI
12 Y. F. Shen, W. Y. Xue, Y. D. Wang, Z. Y. Liu, L. Zuo, Appl. Surf. Sci., 256(3) (2009) 710.   DOI
13 C. K. Chung, W. T. Chang. Microsyst. Technol., 13 (2006) 537.
14 X. Yuan, Y. Wang, D. Sun, H. Yu, Surf. Coat. Technol., 202 (2008) 1895.   DOI
15 F. I. Danilov, V. S. Protsenko, T. E. Butyrina, E. A. Vasil'eva, A. S. Baskevich, Protec. of Met., 42(6) (2006) 560.   DOI
16 Y. B. Song, D.-T. Chin, Plat. Surf. Fin. 87(9) (2000) 80.