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Co-deposition of Si Particles During Electrodeposition of Fe in Sulfate Solution  

Moon Sung-Mo (한국기계연구원 재료기술연구소 표면연구부)
Lee Sang-Yeal (한국기계연구원 재료기술연구소 표면연구부)
Lee Kyu-Hwan (한국기계연구원 재료기술연구소 표면연구부)
Chang Do-Yon (한국기계연구원 재료기술연구소 표면연구부)
Publication Information
Journal of the Korean institute of surface engineering / v.37, no.6, 2004 , pp. 319-325 More about this Journal
Abstract
Fe thin films containing Si particles were prepared on metallic substrates by electrodeposition method in sulfate solutions and the content of codeposited Si particles in the films was investigated as a function of applied current density, the content of Si particels in the solution, solution pH, solution temperature and concentration of $FeSO_4$$7H_2$O in the solution. The amount of Si codeposited in the film was not dependent on the applied current density, solution pH and solution temperature, while it was dependent on the content of Si particles in the solution and the concentration of $FeSO_4$$7H_2$O in the solution. The amount of Si codeposited in the film increased with increasing content of Si particles in the solution but reached a maximum value of about 6 wt% when the content of Si particles in the solution exceeds 100 g/l. On the other hand, the content of Si codeposited in the film increased up to about 17 wt% with decreasing concentration of $FeSO_4$$7H_2$O in the solution. These results would be applied to the fabrication of very thin Fe-6.5 wt% Si sheets for electrical applications.
Keywords
Fe thin film; Fe-6.5 wt%Si sheet; Co-deposition Electroforming; Electrophoretic deposition;
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  • Reference
1 Y. Takada, Y. Tanaka, M Abe, S. Masuda, J. Magn. Magn. Mater., 83 (1990) 375
2 B. Viala, J. Degauque, M. Baricco, E. Ferrara, M. Pasquale, F. Fiorillo, J. Magn. Magn. Mater., 160 (1996) 315   DOI   ScienceOn
3 US PAT. 5262039, Nov. 16 (1993)
4 F. Fiorillo, J. Magn. Magn. Mater., 157/158 (1996) 428
5 Germany PAT. 1247778, Sept. 29 (1971)
6 Y. Takada, T. Murakami, M Abe, Y. Tanaka, S. Masuda, Y. Okami, NKK Tech Rev., 125 (1989) 58
7 R. Moreno, B. Ferrari, Mat. Res. Bull., 35 (2000) 887   DOI   ScienceOn
8 O. A. Lambri, J. I. Perez-Landazabal, L. M. Salvatierra, L. M. Milani, C. Gomez-Polo, V. Recarte, J. NonCryst. Solids, 287 (2001) 70   DOI   ScienceOn
9 J. Ma, R. Zhang, C. H. Liang, L. Weng, Mater. Lett., 57 (2003) 4648   DOI   ScienceOn
10 H. C. Hamaker, Trans. Faraday Soc., 36 (1940) 279
11 S.-M. Moon, M. Sakairi, H. Takahashi, 1. Electrochem. Soc., 150 (2003) B473   DOI   ScienceOn
12 S. Crottier-Combe, S. Audisio, J. Degauque, J. L. Porteseil, E. Ferrara, M. Pasquale, F. Fiorillo, J. Magn. Magn. Mater., 160 (1996) 151