Browse > Article

a-C:H Films Deposited in the Plasma of Surface Spark Discharge at Atmospheric Pressure. Part I: Experimental Investigation  

Chun, Hui-Gon (School of Materials Science and Engineering, ReMM, University of Ulsan)
K.V. Oskomov (Institute of High Current Electronics SD RAS)
N.S. Sochungov (Institute of High Current Electronics SD RAS)
Lee, Jing-Hyuk (School of Materials Science and Engineering, ReMM, University of Ulsan)
You, Yong-Zoo (School of Materials Science and Engineering, ReMM, University of Ulsan)
Publication Information
Journal of the Korean institute of surface engineering / v.36, no.5, 2003 , pp. 357-363 More about this Journal
Abstract
The aim of this work is the synthesis of a-C:H films from methane gas using surface spark discharge at the atmospheric pressure. Properties of these films have been investigated as functions of energy W delivered per a methane molecule in the discharge. The method enables the coatings to be deposited with high growth rates (up to $100 \mu\textrm{m}$/hour) onto large-area substrates. It is shown that the films consist of spherical granules with diameter of 20∼50 nm formed in the spark channel and then deposited onto the substrate. The best film characteristics such as minimum hydrogen-to-carbon atoms ratio H/C=0.69, maximum hardness $H_{v}$ =3 ㎬, the most dense packing of the granules and highest scratch resistance has been obtained under the condition of highest energy W of 40 eV. The deposited a-C:H coatings were found to be more soft and hydrogenated compared to the diamond-like hydrogenated (a-C:H) films which obtained by traditional plasmaenhanced chemical vapor deposition methods at low pressure (<10 Torr). Nevertheless, these coatings can be potentially used for scratch protection of soft plastic materials since they are of an order harder than plastics but still transparent (the absorption coefficient is about $10^4$$10^{5}$ $m^{-1}$ At the same time the proposed method for fast deposition of a-C:H films makes this process less expensive compared to the conventional techniques. This advantage can widen the application field of. these films substantially.y.
Keywords
a-C:H films; methane; atmospheric pressure; spark discharge;
Citations & Related Records
연도 인용수 순위
  • Reference
1 S. Logothetidis and C. Charitidis, Thin Solid Films 208 (1999) 353
2 M. Ham and K. A. Lou, J. Vac. Sci. Technol. A 8 (1990) 2143
3 A.V. Kirikov, V.V. Ryzhov and A.I. Suslov, Proc. 14th Int. Symp. PIasma Chemistry, Ed. M. Hrabovsky (Prague, Czech Republic, 1999) 921
4 J. Zou, K. Schmidt, J. Appl. Phys. 67 (1989) 484
5 M. Cardona, Phys. Stat. Sol. B 118 (1983) 463   DOI   ScienceOn
6 Physical Quantities: Handbook, Eds. I. S. Grigoriev and E. Z. Meylihov (Energoatomizdat, Moscow, 1991)
7 S. Kumar, P. N. Dixit, D. Sarangi and R. Bhattacharyya, Appl. Phys. Lett. 69 (1996) 49   DOI   ScienceOn
8 V. G. Samoylovich, V. I. Gibalov and K. V. Kozlov, Physical Chemistry of the Barrier Discharge, Eds. V. I. Gorshkov and S. D. Razumovsky (Moscow State University Publishing, Moscow, 1989) (in Russian)
9 W. Oliver and G. Pharr, J. Mater. Res. 7 (1992) 1564   DOI
10 L. J. Bellamy, The Infrared Spectra of Comptex MolecuIes (Methuen & Co. LTD, London, 1957)
11 J. Robertson, Surf. Coat. Technol. 50 (1992) 185   DOI   ScienceOn
12 Schwarz and I. Salge, Proc. 11th Int. Symp. Plasma Chemistry, Ed. J.E. Harry (Loughborough, England, 1993) 1071
13 V. Kozyrev, Yu. D. Korolev and K. A. Tinchurin Fizika Plazmy 14 (1988) 1003 (in Russian)
14 A. A. Buharaev, I. V. Berdunov and D. V. Ovchinnikov, Mikroelektronika 26 (1997) 163 (in Russian)