Browse > Article

The Effect of Pulse Plating on the Current Efficiency in Trivalent Chromium Bath  

황경진 (한국과학기술연구원 금속공정연구센터)
안종관 (한국지질자원연구원 자원활용연구부)
이만승 (목포대학교 공과대학 신소재공학과)
오영주 (한국과학기술연구원 금속공정연구센터)
Publication Information
Journal of the Korean institute of surface engineering / v.36, no.2, 2003 , pp. 161-167 More about this Journal
Abstract
In order to investigate the effects of pulse plating conditions on the electrodeposition of trivalent chromium, electroplating experiments from bath with low concentration of trivalent chromium were performed. The variation of current efficiency of chromium electroplating with the electroplating conditions was explained. The maximum current efficiency of pulse plating is 6.4 times as high as that of direct plating at the same mean current density The nodular size increased with pulse plating time and the pulse frequency.
Keywords
Electroplating; Pulsed current; Trivalent chromium;
Citations & Related Records
연도 인용수 순위
  • Reference
1 염희택, 이주성, 도금 · 표면처리, 문운당, 서울6 (1989) 177
2 E. J. Taylor, C. Zhou, R. P. Renz, E. C. Stortz, US Patent US2001/0054557 Al, December 27,(2001)
3 石崎登, 日本實務表面技術,33(6) (1986) 213
4 하종배, 표면기술 WORKSHOP(한국표면공학회) (2002) 61
5 R. P. Renz, E. J. Taylor, M. E. Inman, Proceedings of AESF 5th International Pulse Plating Symposium, Chicago, Illinois, June (2000).ed. J. Cl. Puippe, American Electroplatersand Surface Finishers Society, Inc., Orlando,USA (2000) 1
6 Y. Choi, N. I. Baik, S I. Hong, Thin Solid Films 397(1-2) (2001) 24   DOI   ScienceOn
7 Y. B. Song, D. T. Chin, Plating & Surface Finishing, 87 (9) (2000) 80
8 J. Cl. Puippe, N. Ibl, Plating & Surface Finishing,77(6) (1980) 68
9 백운기, 박수문, 전기화학, 청문각,서울 (2001)119, 329
10 변수일, 송락현, 김창하, 과학기술처보고서N467-3547-1 (1989) 57