The Develop and Research of EPD system for the semiconductor fine pattern etching
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Kim, Jae Pil
(Gigalane)
Hwang, WooJin (Gigalane) Shin, Youshik (Gigalane) Nam, JinTaek (Gigalane) Kim, hong Min (MyungJi University) Kim, chang Eun (MyungJi University) |
1 | S. B. Jung(2006) et al., "Fabrication of Through-hole Interconnect in Si Wafer for 3D Package", Journal of KWS, Vol. 24, No. 2 |
2 | M.Puech(2008) et al., "Fabrication of 3D Packaging TSV using DRIE", DTIP of MEMS & MOEMS 9-11 |
3 | K. H. Baek(2009) et al., "DRIE Technology for TSV Fabrication", Journal of the Korean Society for Precision Engineering Vol. 26, No. 12, pp. 32-40 |
4 | S. Hur(2010) et al., "Fabrication of two-chip type capacitive MEMS microphone", KSME, pp. 4300-4305 |
5 | W. J. Hwang(2011) et al., "Development of Micro-Heaters with Optimized Temperature Compensation Design for Gas Sensors", pp. 2580-2591, Sensors |
6 |
H.Y. Chaeet(2008) al., "Real-Time End-Point Detection Using Modified Principal Component Analysis for Small Open Area |
7 | Gary S. May(2013) et al., "Endpoint Detection Using Optical Emission Spectroscopy in TSV Fabrication", IEEE |
8 | S.J. Hong(2014) et al., "Endpoint Detection in Low Open Area TSV Fabrication Using Optical Emission Spectroscopy", IEEE |
9 | S.S. Han(2012) et al., "Endpoint Detection Strategy in Bosch Process Using PCA and HMM", ECS Transactions 44(1), pp. 1087-1091 |
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