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http://dx.doi.org/10.9725/kstle.2012.28.1.007

Slurry Particle behavior inside Pad Pore during Chemical Mechanical Polishing  

Kwark, Haslomi (Graduate School of Hannam University, Dept. of Mechanical Engineering)
Yang, Woo-Yul (Graduate School of Hannam University, Dept. of Mechanical Engineering)
Sung, In-Ha (Dept. of Mechanical Engineering, Hannam University)
Publication Information
Tribology and Lubricants / v.28, no.1, 2012 , pp. 7-11 More about this Journal
Abstract
In this paper, the results of finite element(FE) analysis of chemical mechanical polishing(CMP) process using 2-dimensional elements were discussed. The objective of this study is to find the generation mechanism of microscratches on a wafer surface during the process. Especially, a FE model with a particle inside pad pore was considered to observe how such a contact situation could contribute to microscratch generation. The results of the finite element simulations revealed that during CMP process the pad-particle mixture could be formed and this would be a major factor leading to microscratch generation.
Keywords
chemical mechanical polishing; finite element analysis(FEA); fluid-structure interaction; Post-CMP surface defects;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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1 Eusner, T., Saka, N., and Chun, J. H., et al., "Controlling Scratching in Cu Chemical Mechanical Planarization," Journal of The Electrochemical Society, Vol. 156, pp. H528, 2009.   DOI
2 Saka, N., Eusner, T., and Chun, J. H., "Scratching by Pad Asperities in Chemical-mechanical Polishing," CIRP Annals - Manufacturing Technology, Vol. 59, No. 1, pp. 329-332, 2010.   DOI
3 Hung, C.-C., Lee, W.-H., and Chang, S.-C., et al., "Investigation of Copper Scratches and Void Defects after Chemical Mechanical Polishing," Japanese Journal of Applied Physics, Vol. 47, No. Copyright (C) 2008 The Japan Society of Applied Physics, p. 7073.
4 Chandra, A., Karra, P., and Bastawros, A. F., et al., "Prediction of Scratch Generation in Chemical Mechanical Planarization," CIRP Annals - Manufacturing Technology, Vol. 57, No. 1, pp. 559-562, 2008.   DOI   ScienceOn
5 김동균, 성인하, "입자연마가공에서의 입자 형상의 영향에 대한 고찰," 한국윤활학회지, 제26권, 제4호, pp. 219-223, 2010.   과학기술학회마을
6 양우열, 양지철, 성인하, "입자연마가공에서의 압력속도 및 유체점도의 영향에 대한 고찰," 한국윤활학회지, 제27권, 제1호, pp. 7-12, 2011.
7 곽하슬로미, 김욱배, 성인하, "입자연마가공에서의 입자크기 및 충돌각의 영향에 대한 고찰," 한국윤활학회지, 제27권, 제1호, pp. 34-39, 2011.   과학기술학회마을   DOI
8 Bathe, K., Zhang, H., and Ji, S., "Finite Element Analysis of Fluid Flows Fully Coupled with Structural Interactions," Computers and Structures, Vol. 72, No. 1, pp. 1-16, 1999.   DOI   ScienceOn
9 De, S., Hong, J., and Bathe, K., "On the Method of Finite Spheres in Applications: Towards the use with ADINA and in a Surgical Simulator," Computational Mechanics, Vol. 31, No. 1, pp. 27-37, 2003.   DOI
10 Li, Y. Microelectronic applications of chemical mechanical planarization: Wiley-Interscience, 2007.
11 Feng, J., Wang, D., and Liu, H., et al., "Finite Element Simulation of Thermal Stress During Diffusion Bonding of Al2O3 Ceramic to Aluminium," Science and Technology of Welding and Joining, Vol. 8, No. 2, pp. 138-142, 2003.   DOI
12 Kim, H. J., "Fundamental Studies on the Scratches during CMP", Proceedings of the ICPT(International Conference on Planarization/CMP Technology), Pheonix, USA, 2010.
13 Yang, J., Oh, D., and Kim, H., et al., "Investigation on Surface Hardening of Polyurethane Pads During Chemical Mechanical Polishing (CMP)," Journal of Electronic Materials, Vol. 39, No. 3, pp. 338-346, 2010.   DOI