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http://dx.doi.org/10.5855/ENERGY.2014.23.4.088

The Study on the Long-term Reliability Characteristics of Ribbon Joint: Solar Cell Ribbon Thickness and Solder Compositions  

Jeon, Yu-Jae (School of Mechanical Engineering, Chung-Ang University)
Kang, Min-Soo (School of Mechanical Engineering, Chung-Ang University)
So, Kyung-Jun (School of Mechanical Engineering, Chung-Ang University)
Lee, Jae-June (School of Mechanical Engineering, Chung-Ang University)
Shin, Young-Eui (School of Mechanical Engineering, Chung-Ang University)
Publication Information
Journal of Energy Engineering / v.23, no.4, 2014 , pp. 88-94 More about this Journal
Abstract
In this paper, Thermal Shock tests were performed varying the composition of the solder and ribbon thickness (A-type:0.2mm/60Sn40Pb, B-type:0.25mm/60Sn40Pb, C-type:0.2 /62Sn36Ag2Pb, D-type:0.25mm/62Sn36Ag2Pb) for evaluating the long-term reliability about Ribbon junction of Silicon solar cells. Thermal Shock test condition was performed during the 600cycles having $-40^{\circ}C{\sim}85^{\circ}C$ temperature range each 15 minutes; One cycle time was 30min. As a result, the initial efficiency of the A-type, B-type, and C, D-type were showed 15.0%, 15.4% and 15.8% respectively. After thermal shock test, the efficiency decreasing-rate of each type were as follow that A-type was 13.8%, B-Type was 15.4%. C-Type and D-Type was 15.3% and 16.2%, respectively. Also, degradation of surface changes and I-V characteristic curves were showed that the series resistance of the A, C-type was increased. Also, current lowering starting point of C-type shown 0.05volt[v] earlier than that of A-type. And B, D-type shown characteristics of composite lowering efficiency such as increase of series resistance, decrease of parallel resistance and cell damage. Therefore Initial solderability and efficiency of specimens using the solder with SnAgPb were superior. But, It has inferior the long-term reliability. The test was confirmed that as the ribbon thickness increases, long-term reliability of solar cell will decrease.
Keywords
Silicon Solar Cell; PV module; Reliability; Thermal Shock Test;
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  • Reference
1 Kang Min-Soo, Kim Do-Seok, Jeon Yu-Jae and Shin Young-Eui, "The Study on Thermal Shock Test Characteristics of Solar Cell for Long-term Reliability Test" , Journal of Energy Engineering, Vol. 21, No. 1, pp. 26-32 (2012)   DOI   ScienceOn
2 Tae-Kyu Chun, Young-Chull Ahn, "Study on Analysis and Evaluation of Performance for Evacuated Tubular Solar Collector System", Journal of Energy Engineering, Vol. 22, No. 2, pp. 112-119 (2013)   DOI
3 S-J Kim, J-Y Choi, J-H Kong, J-H Moon, S-H Lee, W-H Shim, E-H Lee, E-J Lee, H-S Lee, "Soldering Process of PV Module manufacturing and Reliability", VOL.31, NO.2, 2011.11.24.
4 Kang, Min-Soo, Jeon Yu-Jae, Kim Do-Seok, Shin Young-Eui, "Study on the Long-term Reliability of Solar Cell by High Temperature & Humidity Test", Journal of Energy Engineering, Vol. 21, No. 3, pp. 243-248 (2012)   DOI
5 D. C. Jordan, S. R. Kurtz, "Photovoltaic Degradation Rates-an Analytical Review" Progress in Photovoltaics:Research and Applications, prog. Photovolt: Res. Appl.(2011)
6 Kang Min-Soo, Jeon Yu-Jae, Shin Young-Eui, "The Study on the Long- term Reliability Characteristics by Solar Cell Ribbon Thickness", Journal of Energy Engineering, Vol. 22, No. 4 pp. 7-11 (2013)
7 Hsin-Hsin Hsieh, Fu-Ming Lin, Fang-YaoYeh, Mei-HsiuLin, "The effects of temperature and solders on the wettability between ribbon and solar cell", Solar Energy Materials & Solar Cells 93(2009)