Browse > Article

Influence of P and Mg Additions on the Mechanical Properties and Electrical Conductivity of Cu-Sn Based Alloys  

Kim, Jeong-Min (Division of Advanced Materials Engineering, Hanbat National University)
Park, Joon-Sik (Division of Advanced Materials Engineering, Hanbat National University)
Kim, Ki-Tae (Advanced Materials Development Center, Korea Institute of Industrial Technology)
Publication Information
Journal of the Korean Society for Heat Treatment / v.20, no.6, 2007 , pp. 318-322 More about this Journal
Abstract
The high electrical conductivity Cu-0.15% Sn alloys containing various P contents, and the high conductivity and high strength Cu-0.1% Sn-0.1%Ag alloys with various Mg/P additions were fabricated and their mechanical properties and electrical conductivity were investigated. The electrical conductivity was generally decreased as the P content was increased where as the hardness and strength was shown to increase. When Mg was added to P-containing Cu alloys, the detrimental effect of P on the conductivity was significantly reduced, and TEM observations indicated that the formation of $Mg_3P_2$ phase is responsible for this result.
Keywords
Cu-Sn; Cu-Sn-Ag; electrical conductivity; mechanical properties;
Citations & Related Records
연도 인용수 순위
  • Reference
1 M. Janecek, M. Slamova and M. Hajek: J. of Alloys & Comp., 378 (2004) 316   DOI   ScienceOn
2 C. Kittel: Introduction to Solid State Physics, 5th ed., John Wiely & Sons, Inc., (1976) 167
3 D. A. Hay and P. T. Gregg: Wire Journal, 9 (1979) 132
4 J. H. Choi and D. N. Lee : Mater. Sci. & Eng., A 458 (2007) 295   DOI
5 D. P. Lu, J. Wang, W. J. Zeng, Y. Liu, L. Lu and B. D. Sun: Mater. Sci. & Eng., A 421 (2006) 254   DOI   ScienceOn
6 A. Gaganov, J. Freudenberger, E. Botcharova and L. Schultz: Mater. Sci. & Eng., A 437 (2006) 313   DOI   ScienceOn
7 J. Crane and S. Shapiro: US Patent 4, 202, 688 (1980)