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A Study on the Thermal Properties of Mo-Cu Composites as a Heat Sink Material  

Hwang, Chang-Gyu (Dept. of Meterials Engineering, Chungbuk University)
Jang, Gun-Eik (Dept. of Meterials Engineering, Chungbuk University)
Park, Chi-Wan (Dept. of Meterials Engineering, Chungbuk University)
Kim, Tae-Hyoung (Nano Tech Co. Ltd.)
Woo, Yong-Won (Nano Tech Co. Ltd.)
Publication Information
Journal of the Korean Society for Heat Treatment / v.16, no.6, 2003 , pp. 311-314 More about this Journal
Abstract
In Mo-Xwt%Cu compound, Physical and thermal properties were systematically evaluated in terms of Cu contents and sintering temperature. Typically Cu contents were varied from 15 to 25wt% and also the Sintering temperatures were changed from $1115^{\circ}C$ to $1350^{\circ}C$. In physical properties, Mo-15~25wt%Cu has the maximum density of 95% while Mo-20wt%Cu has the maximum thermal conductivity of 165.179[${\mu}/m^{\circ}C$] at sintering temperature of $1300^{\circ}C$. Especially, Mo-25wt%Cu has the maximum hardness of 173.4 at sintering temperature of $1150^{\circ}C$ and the maximum thermal expansion of 9.0[W/mK] as the specimen heated in the range of temperature from $50^{\circ}C$ to $400^{\circ}C$. Based on electrical conductivity measurements, the relative density increased within creasing Cu contents and the values were in the range of 100~150[W/mK].
Keywords
Mo-15~25wt%Cu; Density; Thermal conductivity; Thermal expansion; Hardness;
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