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http://dx.doi.org/10.5757/JKVS.2008.17.2.130

La0.7Sr0.3MnO3 CMR thin film resistor deposited on SiO2/Si and Si substrates by rf magnetron sputtering for infrared sensor  

Choi, Sun-Gyu (School of Advanced Materials Science and Engineering, Yonsei University)
Reddy, A. Sivasankar (School of Advanced Materials Science and Engineering, Yonsei University)
Yu, Byoung-Gon (Electronics and Telecommunications Research Institute)
Ryu, Ho-Jun (Electronics and Telecommunications Research Institute)
Park, Hyung-Ho (School of Advanced Materials Science and Engineering, Yonsei University)
Publication Information
Journal of the Korean Vacuum Society / v.17, no.2, 2008 , pp. 130-137 More about this Journal
Abstract
$La_{0.7}Sr_{0.3}MnO_3$ films were deposited on $SiO_2$/Si and Si substrates annealed at $350^{\circ}C$ by rf magnetron sputtering. The oxygen gas flow rates were varied as 0, 40, and 80 sccm. Without post annealing process, $La_{0.7}Sr_{0.3}MnO_3$ thin films on $SiO_2$/Si and Si substrates were polycrystalline with (100), (110), and (200) growth planes. The grain size of $La_{0.7}Sr_{0.3}MnO_3$ thin films was increased with increasing oxygen gas flow rate. The sheet resistance of $La_{0.7}Sr_{0.3}MnO_3$ thin films was decreased with oxygen flow rate due to the increased grain size which induced a reduction of grain boundary. TCR (temperature coefficient of resistance) values of $La_{0.7}Sr_{0.3}MnO_3$ thin films were obtained from -2.0% to -2.2%.
Keywords
CMR; LSMO; resistor; $SiO_2$/Si; Si; TCR; microbolometer;
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