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http://dx.doi.org/10.3807/KJOP.2009.20.4.236

Implementation of LED Module Using MCPCB with Hard Barrier Anodizing Oxide Layer  

Hong, Dae-Woon (Electronics Engineering Department, Chungnam National University)
Lee, Sung-Jae (Electronics Engineering Department, Chungnam National University)
Cho, Jae-hyun (Department of Materials Science and Engineering, Kyonggi Universiy)
Publication Information
Korean Journal of Optics and Photonics / v.20, no.4, 2009 , pp. 236-240 More about this Journal
Abstract
LED modules, based on MCPCB with a hard barrier oxide layer and an improved thermal dissipation property, are presented. Reflecting cups were also formed on the surface of the MCPCB such that optical coupling between neighboring chips was minimized for improving the photon absorption loss. LED chips were directly attached on the MCPCB by using the COB (Chip On Board) scheme. The LED modules showed significantly enhanced light outputs, compared to the LED modules based on conventional MCPCBs.
Keywords
Light-emitting diode (LED); MCPCB; Hard barrier oxide; COB;
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