Browse > Article
http://dx.doi.org/10.18770/KEPCO.2016.02.03.383

Kissing of Sub-conductors due to Magnetic Forces in a 154 kV Bundled Overhead Transmission Line  

Kim, Sang-Beom (KEPCO Research Institute)
Noh, Hee-Won (KEPCO Research Institute)
Kim, Young-Hong (KEPCO Research Institute)
Ko, Kwang-Man (KEPCO Research Institute)
Park, Jong-Hyuk (KEPCO Research Institute)
Kim, Sang-Soo (Korea Electric Power Corporation)
Publication Information
KEPCO Journal on Electric Power and Energy / v.2, no.3, 2016 , pp. 383-389 More about this Journal
Abstract
Kissing of sub-conductors due to magnetic forces has been investigated in a 154 kV bundled overhead transmission line. With increasing ampacity of the conductors and enlarging the distance between spacers, lager magnetic force was measured. When the phase ampacity was 2,000 amps and the distance between two adjacent spacers was 68 m, for instance, the conductors became unstable and vibrated with a frequency of several herts. Furthermore, when the ampacity was 2,250 amps and the distance between spacers was 136 m, the two sub-conductors were contacted. Analysing the magnetic forces with distance of spacers, the safe distance of spacers to avoid contact of sub-conductors was presented. The change of the safe distance is discussed due to various parameters, such as residual stresses and wind pressures, in the real transmission lines.
Keywords
Overhead transmission line; magnetic force; bundled sub-conductor;
Citations & Related Records
연도 인용수 순위
  • Reference
1 산업통상자원부, 제7차 전력수급기본계획(2015-2029), 2015. 7.
2 김동훈 외, "증용량 & 저이도 가공송전개발 현황", 대한전기학회 하계학술대회, 576-577, 2011.
3 C. Manuzio, "An Investigation of the Forces on Bundle Conductor Spacers under Fault Conditions", IEEE Trans. Power Apparatus and Systems, Vol.PAS-86, No2, 166-184 (1967).   DOI
4 J. L. Lilien et. al., "Calculation of Spacer Compression for Bundle Lines under Short-Circuit", IEEE Trans. Power Delivery, Vol. 15, No2, 839-45 (2000).   DOI
5 E. D. Charles, "Mechanical Forces on Current-Carrying Conductors", Proc. IEEE, Vol. 110, No 9, 1671-77 (1963).