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http://dx.doi.org/10.5302/J.ICROS.2002.8.2.151

A 3D Solder Paste Inspection System Using Multiple Slit Rays  

Cho, Tai-Hoon (한국기술교육대학교)
Huh, Byoung-Hweh (한국기술교육대학교)
Publication Information
Journal of Institute of Control, Robotics and Systems / v.8, no.2, 2002 , pp. 151-157 More about this Journal
Abstract
A 3-dimenstional automatic solder paste inspection system is described that can be used to find defects occurring in solder paste printing process. This system extracts height and volume information very fast as well as area of solder paste printed, using multiple slit ray projection and Galvano-mirror scanning. Methods are presented on calibration of camera and slit projector, real-time image processing of multiple slit images, determination of reference height, and extraction of paste height information are proposed. Performance of the system was successfully demonstrated through field tests.
Keywords
solder paste inspection; structured lighting; 3D measurement; multiple slit rays;
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