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http://dx.doi.org/10.5207/JIEIE.2007.21.5.106

A Study on the Implementation of Optimized Dechucking System  

Seo, Jong-Wan (성균관대학교 정보통신공학부)
Suh, Hee-Seok (두원공과대학 메카트로닉스과)
Shin, Myong-Chul (성균관대 정보통신공학부)
Publication Information
Journal of the Korean Institute of Illuminating and Electrical Installation Engineers / v.21, no.5, 2007 , pp. 106-111 More about this Journal
Abstract
After the semiconductor processing, wafer is attracted by ESC(Electrostatic Chuck) with remaining electric charge. That causes too many problems for examples, sliding of wafer, popping or broken. This paper presents the model of ESC for silicon wafer, which is modeled by electrical circuit component such as capacitor. The simulations using PSpice result in the phenomenon of silicon wafer was charged by ESC. In this paper we suggest the discharging method. for wafer.
Keywords
ESC; Electrostatic Chuck; Dechuck; Wafer; Modeling; Simulation;
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  • Reference
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