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http://dx.doi.org/10.7736/KSPE.2016.33.7.595

Thermal Deformation Analysis of an Orbital Grinding System Grinding Process  

Lee, Hyeon Min (Department of Mechanical Engineering, Korea University)
Choi, Woo Chun (School of Mechanical Engineering, Korea University)
Cho, Chang Rae (Department of R&D, CESCO Co. Ltd.)
Cho, Soon Ju (Department of R&D, CESCO Co. Ltd.)
Publication Information
Journal of the Korean Society for Precision Engineering / v.33, no.7, 2016 , pp. 595-600 More about this Journal
Abstract
An orbital grinding system uses a special motion to machine crankshafts in ships. When a crankshaft is operated, eccentric pins rotate and a grinding wheel moves in order to grind the pins. Thermal error caused by heat generated in the grinding process decreases the quality of the final product. In this study, the thermal error of an orbital grinding system caused by heat generation was investigated in order to predict the extent of thermal error that can occur during the grinding process. Since the machine position changes during orbital grinding, the pin part is divided into 30 degree intervals and heat is generated. Total thermal error was measured by summing the thermal errors associated with the pin and the grinding wheel. Total thermal error was found to reach a maximum at 60 degrees and a minimum at 210 degrees because of the shape of the crankshaft.
Keywords
Orbital grinding; Thermal error; Crankshaft;
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