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Choi, J. C., Kim, B. M., Kim, C., Kim, J. H., Kim, C. B., 'A Study on the Development of Computer Aided Die Design System for Lead Frame,' Semiconductor, JKSPE, Vol. 16, No.6, pp. 123-132, 1999
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Choi, J. C., Kim, B. M., Kim, C, Kim, J. H., Kim, C. B., 'Development of Progressive Die CAD/CAM System for Manufacturing Lead Frame, Semiconductor,' JKSPE, Vol. 16, No. 12, pp. 230-238, 1999
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Kim, Y. Y., 'A Coarse Mesh Model for Numerical Analysis of Leadframe Deformation Due to Blanking Residual Stress,' Submitted to JKSPE, 2004
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Kim, Y. Y., Lee, D. H., 'Local Buckling Analysis of the Punch in Stamping Die and Its Design Modification,' JKSPE, Vol16, No.3, pp. 25-29, 1999
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Hong, S. H., Han, S. Y., Kim, Y. Y., 'A Study on Extraction and its Storage Method of Topological Information from Common 2-D CAD Using the Boundry-Representation Method,' JKSPE, Vol. 16, No.9, pp. 25-33, 1999
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I-Deas Drafting Programmer's Guide, I-Deas MS2.1
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