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Neural Network Based BGA Solder Joint Classification  

김종형 (서울 산업대학교 기계설계자동화공학부)
고국원 (선문대학교 기계 및 제어공학부)
조형석 (한국과학기술원 기계공학과)
Publication Information
Journal of the Korean Society for Precision Engineering / v.20, no.11, 2003 , pp. 7-15 More about this Journal
Keywords
neural network; solder joint inspection; cross-sectional image; X-ray; BGA(gall Grid Array); tomosynthesis;
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[ Y.H.Pao ] / Adaptive Pattern Recognition and Neural Networks
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