1 |
R. Zhang, M. Wang, L. X. Cai, Z. Zheng, X. Shen, and L. L. Xie, "LTE-unlicensed: The future of spectrum aggregation for cellular networks," IEEE Wireless Communications, vol. 22, no. 3, pp. 150-159, Jun. 2015.
DOI
|
2 |
M. Simsek, A. Aijaz, M. Dohler, J. Sachs, and G. Fettweis, "5G-enabled tactile internet," IEEE Journal on Selected Areas in Communications, vol. 34, no. 3, pp. 460-473, Mar. 2016.
DOI
|
3 |
C. Shahriar, M. La Pan, M. Lichtman, T. C. Clancy, R. McGwier, and R. Tandon, et al., "PHY-layer resiliency in OFDM communications: A tutorial," IEEE Communications Surveys & Tutorials, vol. 17, no. 1, pp. 292-314, 2015.
DOI
|
4 |
H. Lee, Y. Chung, D. Kim, R. Ha, Y. I. Jo, and D. Kim, "The status and future prospects of 5G standardization in 3GPP," in Proceedings of Symposium of the Korean Institute of Communications and Information Sciences, Jun, 2017, vol. 2017, no. 6, pp. 803-804.
|
5 |
M. Wen, X. Cheng, M. Ma, B. Jiao, and H. V. Poor, "On the achievable rate of OFDM with index modulation," IEEE Transactions on Signal Processing, vol. 64, no. 8, pp. 1919-1932, Apr. 2016.
DOI
|
6 |
T. Datta, H. S. Eshwaraiah, and A. Chockalingam, "Generalized space-and-frequency index modulation," IEEE Transactions on Vehicular Technology, vol. 65, no. 7, pp. 4911-4924, Jul. 2016.
DOI
|
7 |
E. Basar, M. Wen, R. Mesleh, M. Di Renzo, Y. Xiao, and H. Haas, "Index modulation techniques for next-generation wireless networks," IEEE Access, vol. 5, pp. 16693-16746, 2017.
DOI
|
8 |
X. Zhang, H. Bie, Q. Ye, C. Lei, and X. Tang, "Dual-mode index modulation aided OFDM with constellation power allocation and low-complexity detector design," IEEE Access, vol. 5, pp. 23871-23880, 2017.
DOI
|
9 |
E. Basar, U. Aygolu, E. Panayirci, and H. V. Poor, "Orthogonal frequency division multiplexing with index modulation," IEEE Transactions on Signal Processing, vol. 61, no. 22, pp. 5536-5549, Nov. 2013.
DOI
|
10 |
E. Basar, "Index modulation techniques for 5G wireless networks," IEEE Communications Magazine, vol. 54, no. 7, pp. 168-175, Jul. 2016.
DOI
|