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http://dx.doi.org/10.5515/KJKIEES.2013.24.10.964

RF Capacitive Coupling Link for 3-D ICs  

Choi, Chan-Ki (College of Information and Communication Engineering, Sungkyunkwan University)
Cui, Chenglin (College of Information and Communication Engineering, Sungkyunkwan University)
Kim, Seong-Kyun (College of Information and Communication Engineering, Sungkyunkwan University)
Kim, Byung-Sung (College of Information and Communication Engineering, Sungkyunkwan University)
Publication Information
Abstract
This paper presents a bandpass wireless 3-D chip to chip interface technique. The proposed technique uses direct amplitude modulation of the free running oscillator which especially utilizes the coupling capacitance between two stacked chips as a part of the resonator. Therefore, the oscillator is three dimensionally configured and a simple envelope detector can be used as a receiver without any additional matching circuitry. The proposed link was designed and fabricated using 110 nm CMOS technology and experimental results successfully showed the data transmission at a data rate of 2 Gb/s for the stacked chips with a thickness of 50 ${\mu}m$ consuming 4.32 mW. The sizes of the Tx and Rx chips are 0.045 $mm^2$ and 0.029 $mm^2$, respectively.
Keywords
Capacitive Coupling; Face to Bottom; RF Interconnect; 3D Wireless Communication; Resonator;
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