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Broadband LTCC Receiver Module for Fixed Communication in 40 GHz Band  

Kim Bong-Su (Digital Broadcasting Research Division, ETRI)
Kim Kwang-Seon (Digital Broadcasting Research Division, ETRI)
Eun Ki-Chan (Digital Broadcasting Research Division, ETRI)
Byun Woo-Jin (Digital Broadcasting Research Division, ETRI)
Song Myung-Sun (Digital Broadcasting Research Division, ETRI)
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Abstract
This paper presents how to design and implement a very compact, cost effective and broad band receiver module for IEEE 802.16 FWA(Fixed Wireless Access) in the 40 GHz band. The presented receiver module is fabricated in a multi-layer LTCC(Low Temperature Cofired Ceramic) technology with cavity process to achieve excellent electrical performances. The receiver consists of two MMICs, low noise amplifier and sub-harmonic mixer, an embedded image rejection filter and an IF amplifier. CB-CPW, stripline, several bond wires and various transitions to connect each element are optimally designed to keep transmission loss low and module compact in size. The LTCC is composed of 6 layers of Dupont DP-943 with relative permittivity of 7.1. The thickness of each layer is 100 um. The implemented module is $20{\times}7.5{\times}1.5\;mm^3$ in size and shows an overall noise figure of 4.8 dB, an overall down conversion gain of 19.83 dB, input P1 dB of -22.8 dBm and image rejection value of 36.6 dBc. Furthermore, experimental results demonstrate that the receiver module is suitable for detection of Digital TV signal transmitted after up-conversion of $560\~590\;MHz$ band to 40 GHz.
Keywords
Millimeter-wave; Fixed communication; LTCC;
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1 K. Ohata, K. Maruhashi, M. Ito, S. Kishimoto, K. Ikuina, T. Hashiguchi, K. Ikeda, and N. Takahashi, '1.25 Gbps wireless gigabit ethemet link at 60 GHz-Band', Microwave Symposium Digest, 2003 IEEE MTT-S International, vol. 1, pp. 373-376, Jun. 2003
2 T. P. Budka, 'Wide-bandwidth millimeter-wave bond-wire interconnects', Microwave Theory and Techniques, IEEE Transactions on, vol. 49, pp. 715-718, Apr. 2001   DOI   ScienceOn
3 K. Kim, B. S. Kim, J. W. Lee, K. C. Eun, and M. S. Song, 'Low loss vertical transition for millimeter-wave LTCC module', TSMMW, pp. 114-117, Feb. 2004
4 A. Yamada, E. Suematsu, K. Sato, M. Yamamoto, and H. Sato, '60 GHz ultra compact transmitter/receiver with a low phase noise PLL-Oscillator', Microwave Symposium Digest, 2003 IEEE MTT-S International, vol. 3, pp. 2035-2038, Jun. 2003
5 S. Yun, H. Lee, 'Parasitic impedance analysis of double bonding wires for high-frequency integrated circuit packaging', IEEE Microwave and Guided Wave Letters, vol. 5, pp. 296-298, Sep. 1995   DOI   ScienceOn
6 Y. C. Lee, C. S. Park, 'A 60 GHz stripline BPF for LTCC system-in-Package applications', Microwave Symposium Digest, 2005 IEEE MTT-S International, Jun. 2005   DOI
7 CST MWS ver.5.0
8 K. Maruhashi, K. Ohata, H. Shimawaki, Y. Shoji, and H. Ogawa, 'Small-size 72-GHz-band transceiver modules utilizing IF self-heterodyne transmission technology', Microwave Symposium Digest, 2003 IEEE MTT-S International, vol. 2, pp. 1045-1048, Jun. 2003
9 B. S. Kim, J. W. Lee, K. S. Kim, and M. S. Song, 'PCB substrate integrated waveguide-filter using via fences at millimeter-wave', Microwave Symposium Digest, 2004 IEEE MTT-S International, vol. 2, pp. 1097-1100, Jun. 2004   DOI
10 F. Alimenti, P. Mezzanotte, L. Roselli, and R. Sorrentino, 'Modeling and characterization of the bonding-wire interconnection', Microwave Theory and Techniques, IEEE Transactions on, vol. 49, pp. 142-150, Jan. 2001   DOI   ScienceOn
11 R. Valois, D. Baillargeat, S. Verdeyme, M. Lahti, and T. Jaakola, 'LTCC technology for 40 GHz bandpass waveguide filter', Microwave Symposium Digest, 2005 IEEE MTT-S International, pp. 12-17, Jun. 2005   DOI
12 R. Kulke, G. Mollenbeck, W. Simon, A. Lauer, and M. Rittweger, 'Point-to-multipoint transceiver in LTCC for 26 GHz', IMAPS-Nordic, Proceedings, pp. 50-53, Sep.-Oct. 2002