1 |
Power bus decoupling on multilayer printed circuit boards
/
[
T. H. Hubing;J. L. Drewniak;T. P. Van Doren;D. M. Hoskanson
] /
IEEE Trans. on EMC
|
2 |
The Bridging Effect of the Isolation Moat on the EMI Caused by Ground Bounce Noise between Power/Ground planes of PCB
/
[
J-N. Hwang;T-L. Wu
] /
Proc. IEEE Int. Symp. on EMC.
|
3 |
/
[
Ansoft
] /
HFSS(High Frequency Simulator Structure)(ver 8.0)
|
4 |
Power Bus Isolation Using Power Islands in Printed Circuit Boards
/
[
J. Chen;T. H. Hubing;T. P. Van Doren;R. E. Duroff
] /
IEEE Trans. On EMC.
|
5 |
Grounding optimization techniques for controlling radiation and crosstalk in mixed signal PCBs
/
[
D. Moongilan
] /
Proc. IEEE Int. Symp. on EMC.
|
6 |
Evaluation of SMT Decoupling Design in a Functioning High Speed PCB
/
[
J. Fan;J. L. Knighten;N. W. Smith;J. Neely
] /
Proc. IEEE Int. Symp. on EMC
|
7 |
Quantifying Decoupling Capacitor Location
/
[
J. Fan;J. L. Knighten;A. Orlandi;N. W. Smith;J. L. Drewniak
] /
Proc. IEEE Int. Symp. on EMC
|
8 |
Backplance grounding models for controlling commonmode noise and mechanism
/
[
D. Moongilan;T. S. Palaniswarry
] /
Proc. IEEE Int. Symp on EMC.
|
9 |
/
[
Hennry W. Ott
] /
Noise Reduction Technique in Electronic System
|
10 |
Ferrite를 이용한 전파흡수체
/
[
신재영;오재희
] /
요업재료의 과학과 기술
|
11 |
/
[
EMERSON & CUMING MICROWAVE PRODUCTS, INC
] /
ECCOSORB & MCS
|