Nanometer-Scale Etching of Copper Thin Films Using High Density Plasma of Organic Chelator Material |
Lee, Ji Soo
(Department of Chemical Engineering, Inha University)
Lim, Eun Taek (Department of Chemical Engineering, Inha University) Cha, Moon Hwan (Department of Chemical Engineering, Inha University) Park, Sung Yong (Department of Chemical Engineering, Inha University) Chung, Chee Won (Department of Chemical Engineering, Inha University) |
1 | S. Lee and Y. Kuo, J. Electrochem. Soc., 148, G524 (2001). [DOI: https://doi.org/10.1149/1.1392324] DOI |
2 | O. J. Kwon, S. K. Cho, and J. J. Kim, Korean Chem. Eng. Res., 47, 141 (2009). |
3 | P. A. Tamirisa, G. Levitin, N. S. Kulkarni, and D. W. Hess, Microelectron. Eng., 84, 105 (2007). [DOI: https://doi.org/10.1016/j.mee.2006.08.012] DOI |
4 | S. Rakheja, S. C. Chang, and A. Naeemi, IEEE Trans. Electron Devices, 60, 3913 (2013). [DOI: https://doi.org/10.1109/TED.2013.2282615] DOI |
5 | K. Ohno, M. Sato, and Y. Arita, J. Electrochem. Soc., 143, 4089 (1996). [DOI: https://doi.org/10.1149/1.1837341] DOI |
6 | B. J. Howard and C. Steinbruchel, Appl. Phys. Lett., 59, 914 (1991). [DOI: https://doi.org/10.1063/1.106299] DOI |
7 | S. Lee and Y. Kuo, Thin Solid Films, 457, 326 (2004). [DOI: https://doi.org/10.1016/j.tsf.2003.10.011] DOI |
8 | F. Wu, G. Levitin, and D. Hess, ECS Trans., 33, 157 (2010). [DOI: https://doi.org/10.1149/1.3501042] DOI |
9 | E. T. Lim, J. S. Ryu, J. S. Choi, and C. W. Chung, Vacuum, 167, 145 (2019). [DOI: https://doi.org/10.1016/j.vacuum.2019.05.046] DOI |
10 | J. S. Ryu, E. T. Lim, J. S. Choi, and C. W. Chung, Thin Solid Films, 672, 55 (2019). [DOI: https://doi.org/10.1016/j.tsf.2018.12.042] DOI |
11 | E. Cano, J. M. Bastidas, J. L. Polo, and N. Mora, J. Electrochem. Soc., 148, B431 (2001). [DOI: https://doi.org/10.1149/1.1404968] DOI |
12 | A. Cano, Y. Avila, M. Avila, and E. Reguera, J. Solid State Chem., 276, 339 (2019). [DOI: https://doi.org/10.1016/j.jssc.2019.05.021] DOI |
13 | G. C. Allen, F. Sorbello, C. Altavilla, A. Castorina, and E. Ciliberto, Thin Solid Films, 483, 306 (2005). [DOI: https://doi.org/10.1016/j.tsf.2004.12.062] DOI |
14 | G. Beamson and D. Briggs, High Resolution XPS of Organic Polymers: The Scienta ESCA300 Database (John Wiley & Sons, New York, 1992) p. 182. |
15 | S. S. Chang, H. J. Lee, and H. J. Park, Ceram. Int., 31, 411 (2005). [DOI: https://doi.org/10.1016/j.ceramint.2004.05.027] DOI |
16 | N. Awaya and Y. Arita, J. Electron. Mater., 21, 959 (1992). [DOI: https://doi.org/10.1007/BF02684203] DOI |
17 | M. T. Bohr, Solid State Technol., 39, 105 (1996). |
18 | B. Li, T. D. Sullivan, T. C. Lee, and D. Badami, Microelectron. Reliab., 44, 365 (2004). [DOI: https://doi.org/10.1016/j.microrel.2003.11.004] DOI |
19 | A. Jain, T. T. Kodas, R. Jairath, and M. J. Hampden-Smith, J. Vac. Sci. Technol., B: Nanotechnol. Microelectron.: Mater., Process., Meas., Phenom., 11, 2107 (1993). [DOI: https://doi.org/10.1116/1.586550] DOI |
20 | S. P. Murarka and S. W. Hymes, Crit. Rev. Solid State Mater. Sci., 20, 87 (1995). [DOI: https://doi.org/10.1080/10408439508243732] DOI |
21 | M. H. Cha, E. T. Lim, S. Y. Park, J. S. Lee, and C. W. Chung, Vacuum, 181, 109421 (2020). [DOI: https://doi.org/10.1016/j.vacuum.2020.109421] DOI |
22 | M. Barber, J. A. Connor, M. F. Guest, I. H. Hillier, M. Schwarz, and M. Stacey, J. Chem. Soc., Faraday Trans. 2, 69, 551 (1973). [DOI: https://doi.org/10.1039/F29736900551] DOI |
23 | M. C. Biesinger, Surf. Interface Anal., 49, 1325 (2017). [DOI: https://doi.org/10.1002/sia.6239] DOI |