Browse > Article
http://dx.doi.org/10.4313/JKEM.2021.34.1.33

The Effect of Substrate Temperature on Tribological and Electrical Properties of Sputtered Carbon Nitride Thin Film  

Park, Chan Il (Sungui Science Technology High School)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.34, no.1, 2021 , pp. 33-38 More about this Journal
Abstract
Using facing target magnetron sputtering (FTMS) with a graphite target source, carbon nitride thin films were deposited on silicon and glass substrates at different substrate temperatures to confirm the tribological, electrical, and structural properties of thin films. The substrate temperatures were room temperature, 150℃, and 300℃. The tribology and electrical properties of the carbon nitride thin films were measured as the substrate temperature increased, and a study on the relation between these results and structural properties was conducted. The results show that the increase in the substrate temperature during the fabrication of the carbon nitride thin films increased the hardness and elastic modulus values, the critical load value was increased, and the residual stress value was reduced. Moreover, the increase in the substrate temperature during thin-film deposition was attributed to the improvement in the electrical properties of carbon nitride thin film.
Keywords
Carbon nitride (CNx); Facing targets magnetron sputtering (FTMS); Hardness; Resistivity; Residual stress;
Citations & Related Records
연도 인용수 순위
  • Reference
1 V. Kulikorsky, P. Bohac, F. Franc, A. Deineka, V. Vorlicek, and L. Jastrabik, Diamond Relat. Mater., 10, 1076 (2001). [DOI: https://doi.org/10.1016/s0925-9635(00)00525-2]   DOI
2 X. L. Peng, Z. H. Barber, and T. W. Clyne, Surf. Coat. Technol., 138, 23 (2001). [DOI: https://doi.org/10.1016/s0257-8972(00)01139-7]   DOI
3 D. Liu, G. Benstetter, E. Lodermeier, I. Akula, I. Dudarchyk, Y. Liu, and T. Ma, Surf. Coat. Technol., 172, 194 (2003). [DOI: https://doi.org/10.1016/s0257-8972(03)00338-4]   DOI
4 A. Y. Liu and M. L. Cohen, Phys. Rev., B, 41, 10727 (1990). [DOI: https://doi.org/10.1103/physrevb.41.10727]   DOI
5 H. Li, T. Xu, C. Wang, J. Chen, H. Zhou, and H. Liu, Thin Solid Films, 515, 2153 (2006). [DOI: https://doi.org/10.1016/j.tsf.2006.04.018]   DOI
6 J. Takadoum, J. Y. Rauch, J. M. Cattenot, and N. Martin, Surf. Coat. Technol., 174, 427 (2003). [DOI: https://doi.org/10.1016/s0257-8972(03)00542-5]   DOI
7 A. A. Onoprienko, V. V. Artamonov, and I. B. Yanchuk, Surf. Coat. Technol., 172, 189 (2003). [DOI: https://doi.org/10.1016/s0257-8972(03)00333-5]   DOI
8 N.M.J. Conway, A. C. Ferrari, A. J. Flewitt, J. Robertson, W. I. Milne, A. Tagliaferro, and W. Beyer, Diamond Relat. Mater., 9, 765 (2006). [DOI: https://doi.org/10.1016/s0925-9635(99)00271-x]   DOI
9 S. Souto, M. Pickholz, M. C. dos Santos, and F. Alvarez, Phys. Rev. B, 57, 2536 (1998). [DOI: https://doi.org/10.1103/physrevb.57.2536]   DOI
10 E. Liu, X. Shi, B. K. Tay, L. K. Cheah, H. S. Tan, J. R. Shi, and Z. Sun, J. Appl. Phys., 86, 6078 (1999). [DOI: https://doi.org/10.1063/1.371657]   DOI